Industry Directory | Association / Non-Profit / Events Organizer / Training Provider
The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.
Industry Directory | Manufacturer
XPCB is a PCB manufacturer with superior expertise in multilayer rigid-flex PCB and flex PCB, supporting special technology including VIPPO, stacked vias, buried vias, blind vias, unsymmetrical structure, and air gap structure.
Main product: SMT Assembly Reflow Oven, SMT Hot Air Reflow Oven, Lead Free Reflow Oven, SMT Reflow Oven, SMT Mounting Machine, Elctronic Equipment, PCB Machine, reflow oven, SMT Assembly, SMT/SMD Equipment, PCB Printer, screen printing SMT assembly
Full Hot Air Lead-Free Reflow Oven With PC Temp Control System (A800) Introduce: 1, Heating system adopts ETA patent heating technology 2, The use of imported large current solid state relay contact output, safe, reliable, equipped with a dedicated
Electronics Forum | Tue Apr 09 05:10:39 EDT 2002 | sanchai
Dear sir, Do you have experiment about the temperature cycling and vibration test for reliability testing of surface mount solder attachment. If yes, please give me the soft file sample of parameter setting and testing report.. Thank you very mu
Electronics Forum | Tue Apr 09 08:27:55 EDT 2002 | davef
Read SM-785 - "Guidelines For Accelerated Reliability Testing Of SM Solder Attachments"
Used SMT Equipment | Screen Printers
2.0 Cmk @ ± 12.5 μm (± 6 sigma) System alignment capability > 2.0 Cmk @ ± 25 μm (± 6 sigma) Optimum core cycle time 8 seconds Substrate size 50 mm (X) x 40.5 mm (Y) to 620 mm (X) x 508.5 mm (Y) Operating System Windows 7 Embe
Used SMT Equipment | SMT Equipment
Product name: YC8 small modular chip mounter Product number: YC8 Products in detail Features: support large irregular component small modular placement machine Object substrate: L50 W50mm ~ L330 W360mm x x (1) does When using standard componen
Industry News | 2012-04-06 15:32:39.0
GPD Global, a manufacturer of precision fluid dispensing systems for high-volume 24/7, low-volume/high-mix and R&D production, announces the global release of its PCD4 Dispense Pump after its successful release and testing in the North American market.
Industry News | 2013-07-22 09:54:27.0
GPD Global has introduced its new NCM5000 dispense pump for easy jetting. With only two wetted parts and no seals or springs to replace or adjust, field operation is simple.
Parts & Supplies | Assembly Accessories
Introduction of kic2000 furnace temperature tester Processing customization: Yes Brand: US KIC Model: kic2000 Measurement range: - 50-1050 (℃) Temperature measurement resolution: 0.1 ℃ Dimension: 320 * 86 * 26 (mm) Packing number: 1 t
Parts & Supplies | Assembly Accessories
KIC START profiler,kic thermal profile,smt thermal profilling Image Reflow Profile 9 6 Channel Tester Accuracy: +/-1.2°C Resolution: 0.3 °C to 0.1 °C Internal operating temperature: 0 °C to 105 °C For thermocouples: 9/12 K Ty
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
Increase productivity, improve quality, reduce costs with vertical format curing solutions from Heller Industries. Learn more: http://www.hellerindustries.com/755-Vertical-Oven.php
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | ONLINE | ON DEMAND | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Wed Mar 07 00:00:00 EST 2018 - Wed Mar 07 00:00:00 EST 2018 | ,
Solder Paste Qualification Testing - SMTA Webinar
Events Calendar | Tue Apr 02 00:00:00 EDT 2019 - Tue Apr 02 00:00:00 EDT 2019 | King of Prussia, Pennsylvania USA
IPC Tech Ed - Process and Acceptability Requirements: Utilizing J-STD-001 and IPC-A-610 Together
Career Center | Brooklyn, New York USA | Engineering,Management
Mini-Circuits designs, manufactures and distributes integrated circuits, modules, and sub-systems for high performance radio frequency (RF) and microwave applications. With design, sales and manufacturing locations in over 30 countries, Mini-Ci
Career Center | San Jose/San Fran, California USA | Engineering
Our client, is a forerunner in high temperature semiconductor technology, seeks an Analog IC Design Engineer for their site in CA to work on product definition and designing Mixed Signal ICs. Established experience required in Analog & Mixed Signa
Career Center | San Pedro Sula, Cortes Honduras | Engineering,Maintenance,Management,Technical Support
Preventive maintenance on SMT machines. Corrective maintenance on SMT Machines Schedule of preventive maintenance programs. Minimum Inventory control for spare parts Automation process on SMT Lines Work Instructions for maintenance procedur
Career Center | Cochin, Kerala India | Engineering,Management,Production,Technical Support
9 Years Experience in SMT Manufacturing Process, Quality Control Process, Testing and Engineering of Windmill power projects. The experience include: - � Skill in selection and installation of new manufacturing lines. � Conduct and analyze process t
Article Return to Front Page A Low Temperature Alte
Article Return to Front Page A Low Temperature Alte
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/industrial-coating-systems/additional-product-sub-type/temperature-conditioning?con=t&page=10
: Temperature Conditioning CoolWave® 2 - 610 System Industrial Coating Systems Powder Coating Test Lab Capabilities Brochure Industrial Coating Systems Get the Most from Your Powder Coating Test Prodigy® HDLV®
1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_test_equity.html
Test Equity Test Equity Temperature Chamber Equipment Description Test Equity Model Number: 1007C Serial Number: 10127 Temperature Range: -75C to +175C Temperature Stability
winsouce.jpg)
