Electronics Forum: tent via (142)

Via tent on both side of the PCB; Immersion Tin

Electronics Forum | Fri Oct 05 07:31:29 EDT 2001 | furrer

When tenting vias almost a few vias are not covered completly by Solder Mask. Does this one side open vias affect the Immersion Tin Process ? Do we get chemical residues in the vias ?

Via tent on both side of the PCB; Immersion Tin

Electronics Forum | Sat Oct 06 08:27:24 EDT 2001 | davef

Yes, some solder masks do not tent well, because the material is too thin. That�s the trade-off. Thin masks: * Conform well to [don't bleed onto] fine pitch features. * Tent vias poorly, requiring an additional "plugging" step. As you imply, if th

Industry News: tent via (7)

Via Tent-Holes with Solder Mask

Industry News | 2018-10-18 10:40:04.0

Via Tent-Holes with Solder Mask

Flason Electronic Co.,limited

Making Readable Silkscreen Layouts for your Printed Circuit Board (PCB) Design

Industry News | 2018-10-18 11:18:14.0

Making Readable Silkscreen Layouts for your Printed Circuit Board (PCB) Design

Flason Electronic Co.,limited

Technical Library: tent via (1)

PCB vias design recommendation

Technical Library | 2019-05-29 01:47:22.0

1.Vias near SMD pads: Solder can flow into the via after melted. As a result cold joint will appear in the end. Check the picture below. 2.Vias on SMD pads: Solder can flow into the via more easier after melted. Check the picture below. 3.Via opening without soldermask covered. When workers solder TH parts by hand, soldering iron can touch vias sometime, then tiny amounts molten solder will stay on vias. This can lead to electrical short easily. We recommend you make all vias tenting (covered by solder mask) if it is possible.

PCBNPI-Professional PCB Fab/PCB Assembly Service Provider From China

Express Newsletter: tent via (143)

SMTnet Express - June 27, 2019

SMTnet Express, June 27, 2019, Subscribers: 32,092, Companies: 10,819, Users: 24,882 Advanced Cu Electroplating Process for Any Layer Via Fill Applications with Thin Surface Copper Credits: MacDermid Inc. Copper-filled micro-vias are a key

Partner Websites: tent via (6)

00600-248

Heller 公司 | http://hellerindustries.com.cn/00600-248.pdf

. The typical form for such a profile, Figure 1b, is commonly referred to as a “tent” or “straight ramp” profile. For no- clean pastes, which have less active fluxes, excessive dwell time serves only to deplete the flux before reflow

Heller 公司


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