Industry Directory | Manufacturer / Other
Reduce electrical overstress (EOS) with our EMI filters for soldering, power, ground and servo motors. EMI filters improve equipment up-time and reliability and reduce test problems.
New Equipment | Test Equipment
Anritsu S331B Cable Antenna Analyzers The Anritsu S331B SiteMaster, with frequency coverage of 25 MHz to 3300 MHz, is ideally suited for users who work in VHF, broadcasting, paging, cellular, PCS/GSM and ISM and WLL frequency bands. Both S331B and
New Equipment | Test Equipment
Anritsu S820C Microwave Site Master, 3.3 GHz to 20 GHz, Built in DTF The Anritsu S820C spectrum analyzer is a wide band, very sensitive receiver. It works on the principle of "super-heterodyne receiver" to convert higher frequencies (normally rangi
Electronics Forum | Tue Aug 23 13:03:14 EDT 2005 | davef
What's the point of such a test? * If you are operating a board in an environment that keeps the board at a temperature that is close to causing delamination, why not design a board that can tolerate such an operating environment, rather than contin
Electronics Forum | Mon Feb 26 20:02:42 EST 2001 | davef
First, I don�t understand why your board fabricator can�t do a good job plugging your vias. Additionally, when you consider that they forgot to plug the first batch of boards, it makes me wonder if they are desirable as a supplier. Generally, we us
Used SMT Equipment | General Purpose Test & Measurement
LitePoint IQnxn WiFi MIMO R&D Test Solution features multiple, synchronized vector signal analysis (VSA) and vector signal generator (VSG) instruments designed to characterize and test the latest MIMO WiFi (802.11n) products. The flexible system al
Used SMT Equipment | In-Circuit Testers
Litepoint IQnxn LitePoint IQnxn WiFi MIMO R&D Test Solution features multiple, synchronized vector signal analysis (VSA) and vector signal generator (VSG) instruments designed to characterize and test the latest MIMO WiFi (802.11n) products. Th
Industry News | 2003-06-26 09:02:38.0
The surface quality of printed circuit boards and components directly impacts performance and product life.
Industry News | 2003-06-12 08:24:37.0
An adaptive tool prevents small and/or light components "lifting" or "floating" on printed circuit board assemblies during the wave solder process.
Parts & Supplies | SPI / Solder Paste Inspection
Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK
Technical Library | 2019-11-12 02:09:22.0
Thermal shock test chamber can be used for testing the chemical change or physical damage on composite materials caused by the thermal expansion and contraction of the sample in the shortest time,which is subjected to extremely and continuous high and low temperature environment.so how to check the temperature recovery time of this chamber? Normally we take following steps to inspect the temepratuire recovering time: 1.Install the temperature sensor at the specified position, and adjust the temperature controller of hot zone and cold zone to the required nominal temperature respectively. 2.The temperature increases and reduces respectively,30min after temperature in two zones reach stable status,record temperature value of the measuring point,pls set the temperature value of two zones to be required nominal temperature. 3.The temperature shock test chamber automatically places the inspected load into theh ot zone,select the corresponding retention time according to regulated standard. 4.Set the transfer time,then the inspection load is transferred from hot zone to cold zone, and the temperature of the measuring point is observed and recorded, and then the reverse conversion of the load from cold zone to hot zone is carried out according to the same method, and the temperature of the measuring point is observed and recorded. www.climatechambers.com
Technical Library | 2021-11-26 14:34:07.0
The use of desiccant bags filled with Silica Sand and or Clay beads used in conjunction with a Moisture Barrier Bag to control moisture for storage of printed circuit boards has long been an accepted practice and standard from both JEDEC and IPC organizations. Additionally, the use heated ovens for baking off moisture using the evaporation process has also been a long#2;standing practice from these organizations. This paper on alternative drying methods will be accompanied by completed independent, unbiased tests conducted by Vinny Nguyen, an engineering student (now graduated) from San Jose State University. The accompanied paper will examine the performance levels of different technologies of desiccant bags to control moisture in enclosed spaces. The tests and equipment set were reviewed by an engineer and consultant to the Lockheed Martin Aerospace Division and the IPC - TM-650 2.6.28 test method was review by engineer from pSemi. The tests were designed to mimic performance tests outlined in Mil Spec 3464, which both IPC and JEDEC have adopted for their respective standards. The test examined variables including absorption capacity rates, weight gain and release of moisture back into the enclosed area. The presentation will also address and highlight: • Similarities of PCBs and Heavy Equipment as it applies to Inspections, Causes of Failure, Types of Corrosion and Moisture Collection Points. • Performance Attributes of Different Desiccant Technologies as it applies to shape, texture, change outs, labeling and regeneration. • Venn Diagram of Electromechanical Failure with the circles 1. Current 2. Contamination 3. Humidity Presentation Available
ML-2500S PCB Separator uses high speed rotation milling cutter to separate PCB array. Widely applied in digital, communication, lighting, etc. Which improved the defect on PCB separating caused by manual, V-cut, stamping, etc If you have any questi
Inline 3D SPI, Standard Automatic solder paste inspection system As one of the strongest SMT 3D SPI Manufacuturer in China, we provide you all the different models of online solder paste inspection machine,we have variety of size and models of the
Events Calendar | Thu May 17 00:00:00 EDT 2018 - Fri May 18 00:00:00 EDT 2018 | ,
Tin Whisker - All You Should Know - SMTA Webtorial
Events Calendar | Wed Dec 06 00:00:00 EST 2017 - Wed Dec 13 00:00:00 EST 2017 | Rolling Meadows, Illinois USA
X-Ray of PCBs Webtorial
Career Center | Florham Park, New Jersey USA | Engineering
Field Service Engineer Job Description The basic function of this position: Installation, training, repair, and implementation of retrofits on the complete line of Heller reflow ovens. Candidate must be a US citizen. DUTIES AND RESPONSIBILITIES: S
Career Center | Tallahassee, Florida USA | Engineering,Technical Support
Provides Test Engineering support to the Test and Sales departments; develops test programs/hardware/documentation for new and existing products. Responsible for providing setup, technical support, debug, training, and technical supervision to all s
Career Center | brampton, Ontario Canada | Engineering,Management,Production,Technical Support
- More than 14 years of experience in set-up, calibrate, program, troubleshoot SMT machines and SMT process, for the manufacturing of PCB Electronic Assemblies - 5 year experience in leading position for electronic manufacturing/Process Engineering.
Career Center | san jose, California USA | Engineering
Process Eng, Quality supllier, Fianl QA PCBA, BOX build , SAP, Agile, Excell , mir sof word.box build product
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change of test points. As temperatures rises, its adhesion will drop and thermocouple will deviate from the test point, thus causing test errors. Thermocouple can not be fixed in a small place. Suitable for multiple test points. D. Mechanical connection
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/news/news/2016-08-01
actuated copper alloy translators that are linked to a computer-controlled downstream gauge monitor. The movement, or stroke, of these translators provides gauge control by causing the die gap to increase or decrease
