Industry Directory | Consultant / Service Provider
An independent solder analysis lab. Our services include solder analysis of wave solder machines and solder pots. We test for impurities based on J-STD-006B for most tin and lead based alloys.
Industry Directory | Manufacturer
Since 1986, AAT systems have been design-driven by the science of cleaning. Our systems include batch and inline, aqueous and solvent, spray in air, and batch cleaners with ROSE Testing capabilities.
New Equipment | Test Equipment
The Agilent Medalist i1000 in-circuit test (ICT) system is a low-cost in-circuit test solution which now comes with digital testing capabilities while maintaining its original low-cost fixture solution. The Medalist i1000 in-circuit test (ICT) syst
New Equipment | Solder Materials
Solder Testing from $79 to $149 If you have a wave solder machine, a solder dip pot, or selective soldering system then you should consider the consequences of not monitoring your solder pot. An informal 20 year survey of the electronics manufactur
Electronics Forum | Tue Sep 30 17:45:56 EDT 2003 | davef
Q1: Do you use some sort of commercial software for traceability? Or do you have an huge database and some self programmed data-collection tools for each machine? A1: We use commercial database software. Q2: So just why do you have to trace? Just be
Electronics Forum | Mon Sep 29 05:48:57 EDT 2003 | mario1304
Hello everybody, I already posted in this forum some months ago and I got some useful advices and experiences from the members here, so I thought I�ll post again and see if there are any new points for me. I�m still writing my diploma about traceabi
Used SMT Equipment | In-Circuit Testers
Agilent-Keysight E7476A W-CDMA Drive Test System Description Provides a receiver-based solution, independent of the network, to aid in finding network problems quickly Provides automatic software alarm capability to aid in detecting
Used SMT Equipment | In-Circuit Testers
Tektronix TDS6804B Bandwidth: 8.0 GHz Channels: 4 Tektronix TDS6804B Digital Storage Oscilloscope Digital Storage Oscilloscope Features & Benefits Bandwidths of 15 GHz (TDS6154C), 12 GHz (TDS6124C), 8 GHz (TDS6804B), and 6 GHz (TDS6604B)
Industry News | 2008-12-19 18:59:58.0
Minneapolis, MN � The SMTA and Auburn University are pleased to announce that the AIMS (Automotive, Industrial, Military and Space) Harsh Environment Electronics Symposium will be held October 5-6, 2009. Dr. John Evans, Conference Chairman and the program technical committee invite you to submit an abstract to participate in this exciting program. The symposium will once again focus on harsh environments with an emphasis on military and space.
Industry News | 2010-02-08 12:28:51.0
Minneapolis, MN - The SMTA and Auburn University are pleased to announce that the AIMS (Automotive, Industrial, Military and Space) Harsh Environment Electronics Symposium will be held October 25-26, 2010. Dr. John Evans, Conference Chairman and the program technical committee invite you to submit an abstract to participate in this exciting program. The symposium will once again focus on harsh environments with an emphasis on military and space.
Technical Library | 2013-09-19 17:25:32.0
The next generation of smart phones will demand very thin multi-layer boards to reduce the product thickness again. This paper shows three different manufacturing approaches, which can be used for very thin any-layer build-ups. The technological approaches are compared on reliability level – the any-layer copper filled micro-via technology which is to be considered as state of the art technology for high end phones and the ALIVH-C/G technology that is well established in Japan. A test vehicle design featuring test coupons for comprehensive reliability test series has been defined as target application for investigation...
Technical Library | 2021-07-20 20:02:29.0
During the manufacturing of printed circuit boards (PCBs) for a Flight Project, it was found that a European manufacturer was building its boards to a European standard that had no requirement for copper wrap on the vias. The amount of copper wrap that was measured on coupons from the panel containing the boards of interest was less than the amount specified in IPC-6012 Rev B, Class 3. To help determine the reliability and usability of the boards, three sets of tests and a simulation were run. The test results, along with results of simulation and destructive physical analysis, are presented in this paper. The first experiment involved subjecting coupons from the panels supplied by the European manufacturer to thermal cycling. After 17 000 cycles, the test was stopped with no failures. A second set of accelerated tests involved comparing the thermal fatigue life of test samples made from FR4 and polyimide with varying amounts of copper wrap. Again, the testing did not reveal any failures. The third test involved using interconnect stress test coupons with through-hole vias and blind vias that were subjected to elevated temperatures to accelerate fatigue failures. While there were failures, as expected, the failures were at barrel cracks. In addition to the experiments, this paper also discusses the results of finite-element analysis using simulation software that was used to model plated-through holes under thermal stress using a steady-state analysis, also showing the main failure mode was barrel cracking. The tests show that although copper wrap was sought as a better alternative to butt joints between barrel plating and copper foil layers, manufacturability remains challenging and attempts to meet the requirements often result in features that reduce the reliability of the boards. Experimental and simulation work discussed in this paper indicate that the standard requirements for copper wrap are not contributing to the overall board reliability, although it should be added that a design with a butt joint is going to be a higher risk than a reduced copper wrap design. The study further shows that procurement requirements for wrap plating thickness from Class 3 to Class 2 would pose little risk to reliability (minimum 5 μm/0.197 mil for all via types).Experimental results corroborated by modeling indicate that the stress maxima are internal to the barrels rather than at the wrap location. In fact, the existence of Cu wrap was determined to have no appreciable effect on reliability.
https://www.ascen.ltd/Products/Solder_paste_printer/513.html full auto PCB screen printer and SMT solder paste printing machine with Image and optical system,It is a very accurate fully automatic SMT stencil printer.automatic PCB screen printer main
How to select and install a vacuum tip and pick and place a part using the pen-vac
Events Calendar | Mon Jan 31 00:00:00 EST 2022 - Thu Feb 03 00:00:00 EST 2022 | Honolulu, Hawaii USA
Pan Pacific Microelectronics Symposium
HASL - WHAT A HASSLE, or HASL'd AGAIN. If you don't see the images, please visit online version at #Application.SmtNet.baseURL#/express/ Featured Article HASL - WHAT A HASSLE, or HASL'd AGAIN. Proof Of Design MoonMan This article updates
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_symbol-creation_topic2057.xml
. I need add you to the "Beta Tester" forum group. Symbol Creation? : Hi,Is there still a way to sign... Author: PLTcbvSubject: 2057Posted: 08 Mar 2017 at 12:43amHi,Is there still a way to sign up for Beta Testing the Symbol Expert software
| https://www.eptac.com/webinars/top-5-manufacturing-issues-for-august-2009/
. Second in a series, once again we tackle some of the issues in the industry that may or may not be near and dear to your heart. Tune in and get a technical tune up on some of these widely shared topics
