Electronics Forum | Fri Jan 07 13:17:48 EST 2005 | bschreiber
3) There are several papers on the safety of cleaning PCBs and ICs using ultrasonic technology. The latest is in the October 2004 issue of SMT magazine by William Kenyon, "Why Not Ultrasonics?" Most of the studies have been performed by Dr. B.P. Ri
Electronics Forum | Tue Apr 13 09:50:18 EDT 1999 | Dave F
| Hello. | | I'm now investigating the current technological issues | on surface mount devices. | For example, I want to know the limitation of | the surface mount machine. | | Where can I get the materials for this purpose? | | Thank you | Cho
Industry News | 2018-10-18 10:13:08.0
The Application of the Pin-in-Paste Reflow Process
Industry News | 2018-10-18 09:33:23.0
wave soldering has become the future direction of development
Technical Library | 2017-04-13 16:14:27.0
The drive to reduced size and increased functionality is a constant in the world of electronic devices. In order to achieve these goals, the industry has responded with ever-smaller devices and the equipment capable of handling these devices. The evolution of BGA packages and leadless devices is pushing existing technologies to the limit of current assembly techniques and materials.As smaller components make their way into the mainstream PCB assembly market, PCB assemblers are reaching the limits of Type 3 solder paste, which is currently in use by most manufacturers.The goal of this study is to determine the impact on solder volume deposition between Type 3, Type 4 and Type 5 SAC305 alloy powder in combination with stainless steel laser cut, electroformed and the emerging laser cut nano-coated stencils. Leadless QFN and μBGA components will be the focus of the test utilizing optimized aperture designs.
Technical Library | 2014-12-24 19:22:52.0
For centuries, the squeegee blade has been used throughout many applications for depositing viscous materials through screens and stencils to transfer images on to substrates, from cloth material to electronic circuit boards. One area of blade printing mechanics that have been reviewed many times is the angle of attack of the blade. Typically it has been tested from 45 degrees to 60 degrees to optimize the printing quality and efficiency. However, this typically ends up as a compromise, from fill characteristics (45 degrees) to print definition (60 degrees). This paper will present the revolutionary performance of the profiled squeegee blade, which has recently been developed to create a virtual multi angle of attack for unsurpassed process control for all types of stencil printing processes.
The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish SMTnet Express October 19, 2012, Subscribers: 25598, Members: Companies: 9011, Users: 33828 The Morphology Evolution and Voiding of Solder Joints on QFN
Three-Dimensional MMIC and Its Evolution to WLCSP Technology Three-Dimensional MMIC and Its Evolution to WLCSP Technology by: Tsuneo TOKUMITSU; Sumitomo Electric Industries, Ltd. The history of multilayered, three-dimensional monolithic microwave
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/reflowevolution.pdf
reduction due to low-maintenance equipment. David Heller, Heller Industries, Florham Park, N.J. Advances in solder reflow, as in any other stage of the surface mount assembly process, often are the result of dramatic innovations that lead to the introduction of new technology or equipment
Imagineering, Inc. | https://www.pcbnet.com/blog/the-role-of-pcb-assembly-in-the-internet-of-things-iot/
The Role of PCB Assembly in the Internet of Things (IoT) Skip to main content Resources Support Contact Us FAQs Live Chat My Account 847-806-0003 Menu PCB Capabilities Fabrication Technology Roadmap Materials Available HDI Tolerances Certifications
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