SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Stencil Design for Mixed Technology Through-hole / SMT Placement and Reflow by William E. Coleman, Photo
Blackfox Training Institute, LLC | https://www.blackfox.com/blog/guide-to-a-successful-lead-free-soldering/
. When you transition to lead-free soldering, you will have to make some changes in the already established PCB-design rules. To guarantee manufacturability and dependability, industry guidelines regulate component lead-pad and land size, track width and spacing, via and through-hole dimensions, and other variables
