ProActiv is a breakthrough process technology that dramatically improves solder paste transfer efficiency with stencil printing. It redefines the boundaries of Area Ratio rules for stencil apertures, which dictate the smallest apertures that can be p
Electronics Forum | Wed Aug 07 13:21:58 EDT 2024 | spoiltforchoice
I haven't got numbers for older machines. But for recent models DEK is quite clearly bigger than either a Speedprint/Europlacer or an MPM100. Speedprint/Europlacer focuses on its smaller footprint as a selling point, although it looks to me like a R
Electronics Forum | Sat Nov 17 12:58:12 EST 2007 | mika
I agree with previous postings regarding print speed: Solder paste type/versus fine pitch. Question: Is this a double sided pcb with fairly easy component packages on both sides? In such case, consider make the panel like this: Every second pcb in
Industry News | 2003-04-07 10:16:38.0
Portable Products and Optoelectronic Applications Still Hold Promise for Growth
Industry News | 2018-10-18 08:04:17.0
Influences of the solder material for the wave soldering machine soldering quality
Technical Library | 2023-06-12 19:00:21.0
The SMT print process is now very mature and well understood. However as consumers continually push for new electronic products, with increased functionality and smaller form factor, the boundaries of the whole assembly process are continually being challenged. Miniaturisation raises a number of issues for the stencil printing process. How small can we print? What are the tightest pitches? Can we print small deposits next too large for high mix technology assemblies? How closely can we place components for high density products? ...And then on top of this, how can we satisfy some of the cost pressures through the whole supply chain and improve yield in the production process! Today we are operating close to the limits of the stencil printing process. The area ratio rule (the relationship between stencil aperture opening and aperture surface area) fundamentally dictates what can and cannot be achieved in a print process. For next generation components and assembly processes these established rules need to be broken! New stencil printing techniques are becoming available which address some of these challenges. Active squeegees have been shown to push area ratio limits to new boundaries, permitting printing for next generation 0.3CSP technology. Results also indicate there are potential yield benefits for today's leading edge components as well. Stencil coatings are also showing promise. In tests performed to date it is becoming apparent that certain coatings can provide higher yield processing by extending the number of prints that can be performed in-between stencil cleans during a print process. Preliminary test results relating to the stencil coating technology and how they impact miniaturisation and high yield processing will be presented.
Technical Library | 2018-06-13 11:42:00.0
The art of screen printing solder paste for the surface mount community has been discussed and presented for several decades. However, the impending introduction of passive Metric 0201 devices has reopened the need to re-evaluate the printing process and the influence of stencil architecture. The impact of introducing apertures with architectural dimensions’ sub 150um whilst accommodating the requirements of the standard suite of surface mount connectors, passives and integrated circuits will require a greater knowledge of the solder paste printing process.The dilemma of including the next generation of surface mount devices into this new heterogeneous environment will create area ratio challenges that fall below todays 0.5 threshold. Within this paper the issues of printing challenging area ratio and their associated aspect ratio will be investigated. The findings will be considered against the next generation of surface mount devices.
De-fluxing Eases "Sticky Situations" De-fluxing Eases "Sticky Situations" Using a contract assembler offers several benefits. However, when outsourcing a no-clean process, the challenge for contract assemblers lies with the multiple applications
| https://www.eptac.com/etrainings/category/challenge/
”, inside and out, a challenge... ( Learn more ) Next Class: Coming Soon More Dates… IPC-A-610 Specialist Challenge Recertification – Online Test, Pass the Exam(s
| https://www.smtfactory.com/What-are-the-features-of-the-Full-auto-SMT-Stencil-Printer-id46262477.html
. Its product characteristics and performance advantages require further study. Next, let’s talk about the features of the Full-auto SMT Stencil Printer
A global industrial auction and valuation business with extensive experience in SMT, PCB Assembly & Manufacturing, Test, Semiconductor and other Electronics Machinery & Equipment.
Manufacturer / Equipment Dealer / Broker / Auctions
896 Main Street
Branford, CT USA
Phone: 203-488-7020
