SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Curtailing Voids in Fine Pitch Ball Grid Array Solder Joints by Gary Morrison and Kevin Lyne
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. The solder never wanders under the component package to create a solder bridge regardless of the pin pitch value. At our last IPC-7351C meeting at IPC headquarters in Bannockburn, IL, Dieter Bergman presented the question "What proof did we have that there was ever a problem with pads (lands) under components
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? After SMT machine soldering, there will be some voids in the solder joints. These inevitable voids will cause some potential risks to the quality of the whole product, and the most direct manifestation is that the life of the product will be far less than expected
