Industry Directory | Manufacturer
Heller Thermal Systems India location featuring reflow soldering ovens and pressure curing ovens.
Industry Directory | Manufacturer
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
Dual Chamber Module - Dual Chambers + Dual Blowers + Dual Heaters + Dual T/Cs. Bifurcated (Dual) chamber reflow oven allows 2 different thermal profiles to run simultaneously in the same reflow oven foot print Improved temperature uniformity acro
New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
Electronics Forum | Mon May 23 08:22:31 EDT 2005 | davef
Thermal mass is the ability of a material to absorb heat energy. * A lot of heat energy is required to change the temperature of high density areas, like a ground plane. They are therefore said to have high thermal mass. * Light weight areas, such as
Electronics Forum | Tue Aug 18 18:55:04 EDT 1998 | Sam Guilaume
Does anyone know the actual junction-to-case thermal resistance for TSOPII packages.
Used SMT Equipment | General Purpose Test & Measurement
Model Type: OVS-4 Thermal Supply Voltage: 480 Phase: 3 HZ: 60 Full Load Amps (FLA): 90A Maximum Circuit Protection: 200A Heater Fla: 77A 64kw, Motor Fla: 2.7A 2HP Disconnect Switch Max Interrupt/Capacity: 14.000A Overcurrent Protection Provide
Used SMT Equipment | General Purpose Equipment
Tenney - Blue M Thermal Shock Chamber For Sale See attached pictures and information below Equipment Information Tenney - Blue M - TPS Model Number: WSP-109 Serial Number: 0801000082 Year: 2007 Type: Hot Cold - Shock
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Industry News | 2015-11-12 22:03:28.0
Heller Industries is thrilled to announce that we've partnered with the #1 Northern California Sales Representative Group - Lean-Stream!
Parts & Supplies | Pick and Place/Feeders
MOTOR 59476801;MOTOR 594701;MOTOR 590890;MOTOR 59485301
Parts & Supplies | Assembly Accessories
Part Name: Thermal Profiler Model: KIC Start2 Brand: KIC Accuracy: +/-0.5 Deg.C Temperature Range: Can Up To 350-400 Deg.C Size: 320*86*26（mm） KIC START2 PROFILER Specifications: KIC Start 2 Profiler * Replacement of KIC Start * Stainless Stee
Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
Nano-copper sintering in formic acid vapor.
Training Courses | | | IPC J-STD-001 Space Specialist (CIS)
The J-STD-001 Space Addendum is an additional optional module for the Certified IPC J-STD-001 CIS (Specialist) program for organizations that are required to meet these additional requirements.
Training Courses | | | IPC J-STD-001 Space Trainer (CIT)
The IPC J-STD-001 Space Addendum (CIT) certification courses allow individuals to conduct Certified IPC J-STD-001 Space Addendum Specialist (CIS) training.
Events Calendar | Fri Jul 15 00:00:00 EDT 2022 - Fri Jul 15 00:00:00 EDT 2022 | ,
Multi Chapter/Continent Webinar Series: Thermal Interface Solutions (Presented by Empire Ch.)
Events Calendar | Fri Jul 22 00:00:00 EDT 2022 - Fri Jul 22 00:00:00 EDT 2022 | ,
Multi Chapter/Continent Webinar Series: Thermal Interface Solutions (Presented by India Ch.)
Career Center | , Texas USA | Engineering,Maintenance,Production,Technical Support
Rehm USA LLC sells and services thermal processing equipment for the electronics manufacturing industry. As part of Rehm Anlagenbau GmbH, Rehm USA extends the Rehm product line to the North America market and provides the highest quality service. Jo
Career Center | Dallas, Texas USA | Engineering
Skills/Requirements: Ability to handle compliance issues NEBS, EMI/EMC UL and various customer requirements, required to handle first product builds, BOM's and ECO's. Duties/Functions: Taking requests for new products and coordinating new development
Career Center | , Florida USA | Engineering,Management,Quality Control,Research and Development,Technical Support
Resourceful, innovative professional with over 15 years in the Electronic Industry, with domestic and international experience. Expertise in initiating projects and programs that boost efficiency and productivity while expanding employee education.
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
SMTnet Express, May 4, 2017, Subscribers: 30,444, Companies: 10,591, Users: 23,216 Development of a Consistent and Reliable Thermal Conductivity Measurement Method, Adapted to Typical Composite Materials Used in the PCB Industry Francois
GPD Global | https://www.gpd-global.com/dispensing-thermal-grease.php
Dispensing Thermal Grease Home Products Fluid Dispensing Equipment High Precision Dispenser - MAX Series Large Format Board Dispensing - DS Series Table Top Dispensing Equipment Loader
ORION Industries | http://orionindustries.com/thermal.php
Thermal Transfer Materials ISO 9001:2015 Registered AS 9100 Registered UL Recognized SAM Registered ROHS Compliance Thermal Transfer Materials, Thermal Interface Materials Through our strategic partnership with the Bergquist Company
Heller Thermal Systems India location featuring reflow soldering ovens and pressure curing ovens.
Ahmedabad Gujarat
Ahmedabad, India
Phone: 919910090843
