Industry Directory | Manufacturer
Thermally Managed ( up to 1000 W /m K thermal transfer rate ), CTE controlled, Very Rigid, Light Weight STABLCOR PCB / Substrate Technology
The Henkel line of adhesives includes high temperature electrically conductive epoxy products for every customer’s needs. As the leader in thermal film formulation technology, Henkel has developed a wide variety of film materials for multiple appli
STABLCOR� is a Thermally Managed PCB / Substrate material technology with many benefits: High Thermal Conductivity with a product family that ranges from 100 W/m K up to 1000 W/m K Can more closely match the CTE mismatch that is common today bet
Electronics Forum | Thu Sep 14 14:37:45 EDT 2000 | Serrena Carter
Does anyone know where I can find good rule of thumb information on soldering/brazing. I am most interested learning the maximum recommended CTE mismatch between two different materials that thermally cycle between 25-100C.
Electronics Forum | Wed Feb 07 18:40:39 EST 2007 | bill
What is an acceptable mismatch for smt components and pcb. We are having cracked solder joints from fatigue after repeated thermal cycling 25 deg. c to 125 deg.c.
Industry News | 2019-04-30 17:39:40.0
The SMTA Capital Chapter and UP Media Group/Circuits Assembly Magazine are pleased to co-sponsor an amazing Chapter Tutorial Program. The tutorial will be held on June 11 and showcase the latest technologies, designs and reliability trends.
Industry News | 2015-09-06 18:57:07.0
CyberOptics® Corporation (NASDAQ: CYBE) today announced that Senior Image Processing Research Engineer John Hoffman, PhD will present during the technical session ‘Advances in Process Controls, From 3D Printing to 3D Inspection to Measuring Thermal Expansion Mismatch’, scheduled to take place Wednesday, September 30, 2015 from 2-3:30 p.m. at SMTA International in Rosemont, IL.
Technical Library | 2021-01-13 21:34:29.0
Package-on-Package (PoP) is a popular technology for fabricating chipsets of accelerated processing units. However, the coefficient of thermal expansion mismatch between Si chips and polymer substrates induces thermal warpage during the reflow process. As such, the reflow temperature and reliability of solder joints are critical aspects of PoP. Although Sne58Bi is a good candidate for low-temperature processes, its brittleness causes other reliability issues. In this study, an in-situ observation was performed on composite solders (CSs) made of ...
Technical Library | 2008-11-13 00:06:32.0
The electronics industry is facing issues with hot spots, solder joint stresses and Coefficient of Thermal Expansion (CTE) mismatch between PCB and IC substrate. Flip chip type packages for example have very low CTE compared to traditional PCB material. Thus it is necessary to have low CTE printed circuit boards in order to keep solder joint intact with such low CTE packages. There are currently several materials available in the market to address thermal and CTE challenges but each material has its own advantages and limitations...
There is SPI for Screen Printing. AOI for Pick and Place. Now there is RPI (Reflow Process Inspection) for the Reflow Oven. KIC's RPI provides production reports such as yield analysis, DPMO, Pareto Charts, Cpk and much much more. When RPI is use
SMTnet Express, January 2, 2020, Subscribers: 33,306, Companies: 10,954, Users: 25,467 Temperature Cycling and Fatigue in Electronics Credits: DfR Solutions The majority of electronic failures occur due to thermally induced stresses and strains
| https://www.eptac.com/wp-content/uploads/2016/04/eptac_04_20_16.pdf
Heller Industries Inc. | https://hellerindustries.com/causes-defects-reflow-soldering/
Component Contamination Board Contamination Pad Size Mismatch Cause Open Joint DEFECT Tombstoning Voids Solder Wicking Non-Wetting Incomplete Fillets Poor Strength Solder Shorts Solder Balls
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