Mechatronika MR10 is a fully programmable far infra red oven, suitable for reflow soldering as well as glue heat drying. Soldering sections are controlled by a microprocessor, that also enables the storage of up to sixteen parametrized temperature
SMT-precise designs and manufactures quality yamaha FS2 feeder professionally Hanwha Pick and Place Machine：XM520, HM520, HM510, Excen PRO, Decan S2, Decan S1, SM485P, SM482 Plus, SM481 Plus, SM471 Plus Yamaha Pick and Place Machine: YRM20DL, YRM20,
Electronics Forum | Mon Jun 09 11:11:57 EDT 2014 | cyber_wolf
What does the technical data sheet for the component recommend for reflow profile ? Can you post a photo of the component ?
Electronics Forum | Thu Jan 01 13:04:42 EST 1998 | scott cook
| Has anyone had any experience with thermal shocking | and cracking of SMD capacitors during the rework process? | My company was advised to preheat capacitors to 125 C | at a rate of 2 C/sec before replacing them onto boards. | Would this maybe
Industry News | 2012-05-04 09:21:15.0
As printed boards evolve and chip speeds increase, the use of microwave technology in commercial applications, such as cell phone towers and in military products, is expanding.
Industry News | 2018-10-18 10:12:06.0
Under what conditions do you set different temperatures for the TOP and Bottom heating elements of a reflow oven?
Technical Library | 2010-04-29 21:40:37.0
The purpose of this paper is to investigate the effects of reflow time, reflow peak temperature, thermal shock and thermal aging on the intermetallic compound (IMC) thickness for Sn3.0Ag0.5Cu (SAC305) soldered joints.
Technical Library | 2017-10-16 15:03:32.0
The miniaturization and advancement of electronic devices have been the driving force of design, research and development, and manufacturing in the electronic industry. However, there are some issues occurred associated with the miniaturization, for examples, warpage and reliability issues. In order to resolve these issues, a lot of research and development have been conducted in the industry and university with the target of moderate melting temperature solder alloys such as m.p. 280°C. These moderate temperature alloys have not resolve these issues yet due to the various limitations. YINCAE has been working on research and development of the materials with lower temperature soldering for higher temperature application. To meet this demand, YINCAE has developed solder joint encapsulant paste to enhance solder joint strength resulting in improving drop and thermal cycling performance to eliminate underfilling, edge bonding or corner bonding process in the board level assembly process. This solder joint encapsulant paste can be used in typical lead-free profile and after reflow the application temperature can be up to over 300C, therefore it also eliminates red glue for double side reflow process. In this paper, we will discuss the reliability such as strength of solder joints, drop test performance and thermal cycling performance using this solder joint encapsulant paste in detail.
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High-end Customized Reflow Soldering Oven ❙ Introduce of Reflow Oven ETA provide high reliability special reflow oven, SMD reflow soldering oven, radiator reflow oven, hot air reflow oven, for radiator production line. Special reflow o
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Some key points you may find relevant to this job opportunity include: Extensive experience and knowledge on Service and Technical skills by performing Set-up, Buy-off, troubleshooting of the assigned Equipments. Provide solution to custom
Career Center | NORTHRIDGE, California USA | Engineering
EDUCATION BS Electronics and Communication Engineering Gujarat University MS Electrical Engineering California State University, Northridge ACADAMIC PROJECT Fabrication and Characterization of Silicon Carbide (SiC) MESFE
Thermal Characteristics of PCB Laminates used in High Frequency Applications SMTnet Express July 11, 2012, Subscribers: 25312, Members: Companies: 8920, Users: 33335 Thermal Characteristics of PCB Laminates used in High Frequency Applications First
Improvement of Organic Packaging Thermal Cycle Performance Measurement Featured Article Improvement of Organic Packaging Thermal Cycle Performance Measurement Endicott Interconnect Technologies Glenn O. Dearing, Paul J. Hart Flip Chip Plastic
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/applications-corner/thermal-management-spotlight-thermal-gap-filler
Thermal Management - Spotlight Thermal Gap Filler ASYMTEK Products Corporate | Global Directory | Languages Division Only All of Nordson Fluid Dispensing Systems Jets
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>> SMT Technical Reflow oven zone temperature set up and thermal profile The process of hot air reflow soldering is essentially a heat transfer process
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