Ceramic positive temperature coefficient PTC thermistor help provide protection against power cross, power induction surges and lighting surge defined in ITU, Telcordia, UL. Available in chip, radial-leaded coated and non-coated configuration. This
Radial Resin Bead NTC Thermistor Temperature Sensor is polycrystalline mixed oxide ceramics made semiconductor type NTC Thermistor chip soldered with radial metal wire, coated with epoxy resin bead, for temperature measurement range -45C to +125C.
Electronics Forum | Fri Sep 12 08:01:55 EDT 2008 | davef
There is no standard. On the web, you can find shelf life estimates for various types of solderability protection on bare boards. These estimates won't translate directly to the storage of assembled boards, because assembled boards [and the solderabi
Electronics Forum | Sun Aug 08 20:59:55 EDT 1999 | Dreamsniper
| | | What oven temperature should be used to reflow solder (Sn63Pb37) on a PC board (0.075" to 0.100" thickness) in 5 to 10 minutes? | | | | Profiling - tedious but important. As said, start with the paste manufacturers recomendation which is usua
Industry News | 2019-04-14 18:51:44.0
IPC -- Association Connecting Electronics Industries® invites engineers, researchers, academics, technical experts and industry leaders to submit presentation topics and descriptions for IPC Electronics Materials Forum, a new technical conference focusing on developments in materials and processes associated with electronics assembly and manufacturing. The conference will be held in Minneapolis, Minn., November 5-7, 2019.
Industry News | 2020-02-18 14:50:19.0
IPC invites engineers, researchers, academics, technical experts and industry leaders to submit abstracts for the IPC Electronics Materials Forum – From Fabrication to Assembly – to be held June 18, 2020 in Raleigh, N.C., in conjunction with IPC SummerCom.
Technical Library | 2018-05-23 12:12:43.0
Driven by miniaturization, cost reduction and tighter requirements for electrical and thermal performance, the use of lead-frame based bottom-termination components (LF-BTC) as small-outline no-leads (SON), quad-flat no leads (QFN) packages etc., is increasing. However, a major distractor for the use of such packages in high-reliability applications has been the lack of a visible solder (toe) fillet on the edge surface of the pins: because the post-package assembly singulation process typically leaves bare copper leadframe at the singulation edge, which is not protected against oxidation and thus does not easily solder-wet, a solder fillet (toe fillet) does not generally develop.
Overview of PRO 1600 Forced Convection Reflow Oven in operation. Features include small footprint (31" x 31"), lead free reflow capable, and precise software process control.
Overview of PRO 1600 Forced Convection Reflow Oven in operation. Features include small footprint (31" x 31"), lead free reflow capable, and precise software process control.
SMTnet Express, November 4, 2021, Subscribers: 26,512, Companies: 11,460, Users: 26,912 Fabrication Of Solderable Intense Pulsed Light Sintered Hybrid Copper For Flexible Conductive Electrodes Additively printed circuits provide
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/thermal-compounds?con=t&page=39
time than most industrial thermal interface materials. Also be sure to see our range of high quality solder paste formulations. Products Content Your results for
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Bestemp 6/10/15 channel Thermal Profiler_Shenzhen Honreal Technology CO.,Ltd. HOME ABOUT Company Profile Work shop Honors Package Our Client PRODUCTS Pick and Place Machine SMT nozzle and feeder SMT Reflow Oven Line Dip wave soldering line PCB handling equipment SMT Cutting
