Industry Directory: thermal relief basics (2)

Interconnect Systems, Inc.

Industry Directory | Manufacturer

Semiconductor Enhancement Products

Budapest University of Technology and Economics

Industry Directory | Research Institute / Laboratory / School

BME is considered the world's oldest Institute of Technology which has university rank and structure. It was the first institute in Europe to train engineers at university level.

New SMT Equipment: thermal relief basics (32)

SMT Dispensing Pumps for Integration

SMT Dispensing Pumps for Integration

New Equipment | Dispensing

Retrofit existing system with Innovative Dispensing Technology for Excellent Dispense Control and Repeatability Advanced pump technologies available for retrofitting include: True Volumetric Pump, Precision Auger Pump, Simplified Jetting Pump and Ti

GPD Global

BGA Rework Training & Certification

BGA Rework Training & Certification

New Equipment | Education/Training

This course is designed for students that require the hands-on skill and knowledge to reliably remove and install many types of the most complex BGA components. Students are taught methods for safe and reliable BGA component rework using a top of the

Precision PCB Services, Inc

Electronics Forum: thermal relief basics (148)

Re: Soldering to thru-hole lead to ground plane without thermal relief

Electronics Forum | Mon Jun 19 19:08:21 EDT 2000 | Brian W.

IPC-610 Rev B: Paragraph 4.1 (page 52), As an exception to fil requirements on Table 4-1 on thermal heat sink planes plated through holes, a 50% vertical fill of solder is permitted, but with solder extending 360 degrees around the lead with 100% wet

Thermal relief question

Electronics Forum | Sat Jun 11 07:51:15 EDT 2016 | davef

Hi Steve ... There are arguments between fabricators and thermal relievers about adding non-connected copper tabs to barrels in hopes of providing thermal relief, but that's not what you're talking about, I believe. I don't foresee an issue moving t

Used SMT Equipment: thermal relief basics (2)

FLIR A320

FLIR A320

Used SMT Equipment | In-Circuit Testers

FLIR A320 High Resolution, Plug & Play Infrared Camera for Machine Vision The FLIR A320 Infrared Camera is an affordable and accurate solution for machine vision and automation systems that require non-contact imaging and temperature measurement

Test Equipment Connection

Zebra Technologies 96 XiIII Plus

Zebra Technologies 96 XiIII Plus

Used SMT Equipment | Labeling Systems

Zebra 96 XiIII Plus *multiple units available* Standard Features:Full function front panel and multilingual back-lit LCD display with user programmable password protectionFlash memory including 2.0MB non-volatile memory storage for downloadable objec

Tekmart International Inc.

Industry News: thermal relief basics (78)

Revive Your Dispenser with Advanced Dispense Technologies

Industry News | 2016-12-09 23:33:42.0

GPD Global offers advanced dispense pump technologies to upgrade your existing platform and take advantage of existing capital equipment. Retrofit your system with innovative dispensing technology for excellent dispense control and repeatability.

GPD Global

Altium CAM System and Free ODB++ Viewer Bridge Gap Between PCB Design and Manufacture

Industry News | 2003-03-11 08:45:00.0

CAMtastic DXP is the latest version of Altium's complete CAM verification and editing system that bridges the gap between PCB design and manufacturing and facilitates communication between board designers, fabrication engineers, and their clients.

SMTnet

Parts & Supplies: thermal relief basics (3)

Siemens DP-Drive 03058627S06

Siemens DP-Drive 03058627S06

Parts & Supplies | SMT Equipment

00376260-05 Upgrade Package SIPLACE C Pro (V3.2) 00376294S01 SPRING PLATE (DPF) 00376301S01 Support for rocker 1 assy (DPF) 00376330-03 Software WIN 2003 Server (3), SiplacePro 00376350-09 SOFTWARE WIN XP-SP3 Machine SiPro-2.09 00376370-09 Softw

Qinyi Electronics Co.,Ltd

Siemens DP-Drive cpl 03050314S04

Siemens DP-Drive cpl 03050314S04

Parts & Supplies | SMT Equipment

00377151-03 PULL RELIEF Y-GANTRYCABLE F5HM CF 00377152-01 RF Scanner - power cradle kit - 433MHz 00377154-01 RF Scanner Power Supply (230V) 00377155-01 RF Scanner RS232 Cable 00377156-01 RF Scanner - cordless laser gun 433MHz 00377168-01 RF Scan

Qinyi Electronics Co.,Ltd

Technical Library: thermal relief basics (4)

ADVANCED BORON NITRIDE EPOXY FORMULATIONS EXCEL IN THERMAL MANAGEMENT APPLICATIONS

Technical Library | 2020-10-14 14:33:36.0

Epoxy based adhesives are prevalent interface materials for all levels of electronic packaging. One reason for their widespread success is their ability to accept fillers. Fillers allow the adhesive formulator to tailor the electrical and thermal properties of a given epoxy. Silver flake allow the adhesive to be both electrically conductive and thermally conductive. For potting applications, heat sinking, and general encapsulation where high electrical isolation is required, aluminum oxide has been the filler of choice. Today, advanced Boron Nitride filled epoxies challenge alternative thermal interface materials like silicones, greases, tapes, or pads. The paper discusses key attributes for designing and formulating advanced thermally conductive epoxies. Comparisons to other common fillers used in packaging are made. The filler size, shape and distribution, as well as concentration in the resin, will determine the adhesive viscosity and rheology. Correlation's between Thermal Resistance calculations and adhesive viscosity are made. Examples are shown that determination of thermal conductivity values in "bulk" form, do not translate into actual package thermal resistance. Four commercially available thermally conductive adhesives were obtained for the study. Adhesives were screened by shear strength measurements, Thermal Cycling ( -55 °C to 125 °C ) Resistance, and damp heat ( 85 °C / 85 %RH ) resistance. The results indicate that low modulus Boron Nitride filled epoxies are superior in formulation and design. Careful selection of stress relief agents, filler morphology, and concentration levels are critical choices the skilled formulator must make. The advantages and limitations of each are discussed and demonstrated.

Epoxy Technology, Inc.

The Basics of Package/Device Cooling

Technical Library | 1999-05-06 11:42:16.0

The most reliable and well-designed electronic device can malfunction or fail if it overheats. Considering thermal issues early in the design process results in a thermally conscious system layout and minimizes costs through the use of passive cooling and off-the-shelf components. When thermal issues are left until completion of the design, the only remaining solution may be a costly custom heat sink that requires all the space available. Incorporating a heat sink or a fan into a product after it is fully developed can be expensive, and still may not provide sufficient cooling of the device.

Aavid Thermalloy, LLC

Videos: thermal relief basics (13)

No drip or drool across a wide range of fluid viscosities (low-to-mid and low-to-high) with GPD Global PCD Pumps for total control of your dispensing fluids.

No drip or drool across a wide range of fluid viscosities (low-to-mid and low-to-high) with GPD Global PCD Pumps for total control of your dispensing fluids.

Videos

http://www.gpd-global.com No drip no drool across a wide range of fluid viscosities (low-to-mid and low-to-high). No manual adjustment to compensate for pump variability. Truly Volumetric PCD Pumps for total control of dispensing fluids. Ability to

GPD Global

Siemens DP-Drive 03058627S06

Videos

00376260-05 Upgrade Package SIPLACE C Pro (V3.2) 00376294S01 SPRING PLATE (DPF) 00376301S01 Support for rocker 1 assy (DPF) 00376330-03 Software WIN 2003 Server (3), SiplacePro 00376350-09 SOFTWARE WIN XP-SP3 Machine SiPro-2.09 00376370-09 Softw

Qinyi Electronics Co.,Ltd

Training Courses: thermal relief basics (6)

IPC J-STD-001 Space Addendum (CIS) Certification Training Course

Training Courses | | | IPC J-STD-001 Space Specialist (CIS)

The J-STD-001 Space Addendum is an additional optional module for the Certified IPC J-STD-001 CIS (Specialist) program for organizations that are required to meet these additional requirements.

Blackfox Training Institute, LLC

BGA Rework Training & Certification

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

Events Calendar: thermal relief basics (1)

Electronics Cooling Fundamentals (The Basics of Electronics Cooling)

Events Calendar | Thu Jul 26 00:00:00 EDT 2018 - Thu Jul 26 00:00:00 EDT 2018 | ,

Electronics Cooling Fundamentals (The Basics of Electronics Cooling)

Advanced Thermal Solutions, Inc

Career Center - Jobs: thermal relief basics (1)

Field Service Engineer

Career Center | , Texas USA | Engineering,Maintenance,Production,Technical Support

Rehm USA LLC sells and services thermal processing equipment for the electronics manufacturing industry. As part of Rehm Anlagenbau GmbH, Rehm USA extends the Rehm product line to the North America market and provides the highest quality service. Jo

rehm usa, llc

Career Center - Resumes: thermal relief basics (10)

JAMES R

Career Center | ELLENWOOD, Georgia USA | Production,Quality Control,Research and Development,Technical Support

SMT MACHINE OPERATION, FORKLIFT CERTIFY,  SUPERVISION OF MANUFACTURING AND PRODUCTION, QUALITY CONTROL TECH., AUDIO ENGINEER SKILLS,,SET-UP OF MUSICIAL THEMES AND PLAYS.

BankeemChheda-Resume

Career Center | Rochester, New York USA | Engineering

I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research

Express Newsletter: thermal relief basics (410)

Partner Websites: thermal relief basics (1090)

Thermal Interface Materials (TIM) | Thermal Compound | Nordson EFD

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/products/thermal-compounds?con=t&page=24

Thermal Interface Materials (TIM) | Thermal Compound | Nordson EFD Nordson EFD Corporate | Global Directory | Languages Division Only All of Nordson Home Products Accessories

ASYMTEK Products | Nordson Electronics Solutions

Alloy Composition and Thermal Fatigue of High Reliability Pb-Free Solder Alloys

Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5296

Alloy Composition and Thermal Fatigue of High Reliability Pb-Free Solder Alloys 中文 MEMBERS LOGIN Membership Become a Member! Renew Membership About SMTA Ambassadors Benefits Classifications Member Directory Member Directory Corporate Suppliers Corporate Users Consultants List Advertisers Update Your Info

Surface Mount Technology Association (SMTA)


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