Industry Directory | Manufacturer
An innovative thermal management company that is dedicated to address the thermal challenges that the electronics industry is facing.
Industry Directory | Manufacturer / Manufacturer's Representative
We specialize in EMI Ferrite Core, Thermal Pads, Gaskets and shielding products.
New Equipment | Rework & Repair Equipment
The BEST PCB Epoxy Repair Kit can be used to repair lifted pads and traces as well as build up and repair edge corner damage to PCBs or repair solder mask which has been damaged or removed. By adding colorants a pcb color epoxy kit can be made up cus
New Equipment | Rework & Repair Services
BGA Rework Service - Your BEST Source For High Quality BGA Rework Services BEST provides industry-leading solutions for BGA and other grid array device reworks. Our engineers have developed better processes to make BGA Rework Service more repeatable
Used SMT Equipment | Soldering - Selective
Pillarhouse JADE MKII Selective Soldering Machine Make: Pillarhouse Model: JADE MKII Year: 2015 Lead-Free Integral PC & Machine Mounted TFT Monitor Inerted Nitrogen System Auto Solder Top-Up (Wire Feed) & Solder Level Detect Drop-Jet Fluxer Internal
Used SMT Equipment | Soldering - Selective
Pillarhouse Jade MKII Selective Soldering Machine Model: Jade MKII Year: 2016 Lead-Free Drop Jet Fluxer Top Side IR Pre-Heat Auto Soler Top-Up & Solder Level Detect Inerted Nitrogen System Thermal Nozzle Calibrati
Industry News | 2003-02-24 09:32:24.0
Now available with an easy-to-use dispensing gun, Electrolube TCR is a single-component, highly thermally conductive RTV sealant.
Industry News | 2003-03-11 08:45:00.0
CAMtastic DXP is the latest version of Altium's complete CAM verification and editing system that bridges the gap between PCB design and manufacturing and facilitates communication between board designers, fabrication engineers, and their clients.
Technical Library | 2007-01-31 15:17:04.0
The goal of this project is to evaluate the reliability of lead-free BGA solder joints with a variety of different pad sizes using several different BGA rework methods. These methods included BGAs reworked with both flux only and solder paste attachment techniques and with or without the use of the BEST stay in place StencilQuick™. The daisy chained test boards were placed into a thermal test chamber and cycled between -25ºC to 125ºC over a 30 minute cycle with a 30 minute dwell on each end of the cycle. Each BGA on the board was wired and the continuity assessed during the 1000 cycles the test samples were in the chamber.
Technical Library | 2020-10-14 14:33:36.0
Epoxy based adhesives are prevalent interface materials for all levels of electronic packaging. One reason for their widespread success is their ability to accept fillers. Fillers allow the adhesive formulator to tailor the electrical and thermal properties of a given epoxy. Silver flake allow the adhesive to be both electrically conductive and thermally conductive. For potting applications, heat sinking, and general encapsulation where high electrical isolation is required, aluminum oxide has been the filler of choice. Today, advanced Boron Nitride filled epoxies challenge alternative thermal interface materials like silicones, greases, tapes, or pads. The paper discusses key attributes for designing and formulating advanced thermally conductive epoxies. Comparisons to other common fillers used in packaging are made. The filler size, shape and distribution, as well as concentration in the resin, will determine the adhesive viscosity and rheology. Correlation's between Thermal Resistance calculations and adhesive viscosity are made. Examples are shown that determination of thermal conductivity values in "bulk" form, do not translate into actual package thermal resistance. Four commercially available thermally conductive adhesives were obtained for the study. Adhesives were screened by shear strength measurements, Thermal Cycling ( -55 °C to 125 °C ) Resistance, and damp heat ( 85 °C / 85 %RH ) resistance. The results indicate that low modulus Boron Nitride filled epoxies are superior in formulation and design. Careful selection of stress relief agents, filler morphology, and concentration levels are critical choices the skilled formulator must make. The advantages and limitations of each are discussed and demonstrated.
PCB pad repair technique demonstrated using the 2-part epoxy method. More on this PCB pad repair technique: http://www.solder.net/services/pcb-repair/pad-and-trace-repair/ More on the recommended epoxy: http://www.soldertools.net/pcb-repair-epoxy-r
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Career Center | NORTHRIDGE, California USA | Engineering
EDUCATION BS Electronics and Communication Engineering Gujarat University MS Electrical Engineering California State University, Northridge ACADAMIC PROJECT Fabrication and Characterization of Silicon Carbide (SiC) MESFE
SMTnet Express, May 7, 2020, Subscribers: 36,108, Companies: 11,001, Users: 25,793 Solutions for Selective Soldering of High Thermal Mass and Fine-Pitch Components Credits: Nordson SELECT The selective soldering process has evolved to become a
ORION Industries | http://orionindustries.com/pdfs/thermal.pdf
. Sil-Pad , Gap Pad, and Q-Pad are registered trademarks of The Bergquist Company. One Orion Park Drive, Ayer, MA 01432 • Phone: 978-772-6000 • Fax: 978-772-0021 • E-mail: info@orionind.com • www.orionindustries.com ORION INDUSTRIES INCORPORATED GAP PADS Material Thickness Range Thermal Conductivity Gap Pad V0 Soft
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/products/thermal-compounds?con=t&page=24
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