Electronics Forum | Mon Aug 16 11:58:29 EDT 2004 | Dreamsniper
I've worked with a Vapor Phase Oven a semi-automatic and a manual oven for evaluation. They worked fine and produce better grain of solder joints. The fluid that you need depends on the solder temperature that you require. I've used a 200'C fluid for
Electronics Forum | Fri Sep 17 09:54:40 EDT 1999 | Brian
| | | We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a
Industry News | 2010-05-07 16:01:14.0
New this year! The SMTA International Technical Committee invites you to participate in a poster session at SMTA International. Poster sessions are presented on the show floor and are a great way to present current research and results in a concise manner without requiring a technical paper.
Industry News | 2018-04-16 20:18:35.0
SMTA Europe announces Session 5 Technical Program on Adhesives and Coatings at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/fluid-types/thermal-interface-material-tim
1.5 refers to materials dispensed between an IC without a lid and a heatsink. TIM 1, TIM 2, and TIM 1.5 examples: Dispensable TIM Materials Thermal Grease Thermal greases are silicone-based materials containing thermally conductive fillers
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5454
. The focus is on the influence of Bi, Sb and/or In combinations on the intermetallic layers on Cu and Ni-based substrates, the primary and eutectic solidification phases, phase formation due to solid
