Competitive Advantage: 1. CWVC-3 Pcb depanelizer original manufacturers, price concessions 2. Day technical support services 3. Limit the handling of complaints, half an hour back to
New Equipment | Rework & Repair Equipment
BEST HotDots™ are designed to simply and cleanly attach jumper wires on a board. HotDots™ are built to survive at high temperature as both the adhesive and the polyimide material are designed to withstand wash and reflow temperatures. HotDots™ are a
Electronics Forum | Tue Jan 09 04:32:58 EST 2007 | d0min0
Hello everyone, any estimation how many (minimum)thermocouples on board, how to calculate this ? regards
Electronics Forum | Thu Dec 21 22:13:37 EST 2006 | davef
Look here: http://www.smtinfo.net/Db/_Thermal%20Profiling.html
Industry News | 2018-10-18 10:17:48.0
How to attach a thermocouple to a target PCB?
Industry News | 2018-10-18 10:20:21.0
How to get real-time thermal data for a PCB?
BESTEMP reflow checker 6 channel temperature profiler Reflow soldering temperature tester Characteristic: 1..High efficiency, data can be stored up to 16 times continuously, and can be downloard to computer for group data viewing. 2. Modular analys
This video demonstrated the use of BEST Inc HotDots(TM) which allow wires to be affixed to the PCB or other surfaces-even when those surfaces go through reflow. There are other similar products out there but none of which can be readily customized no
Evaluating The Accuracy Of a Nondestructive Thermocouple Attach Method For Area-Array Package Profiling Evaluating The Accuracy Of a Nondestructive Thermocouple Attach Method For Area-Array Package Profiling The oven recipe, which consists
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/products/valves/square-wave-non-contact-dispense-valve
Nordson EFD | Square Wave™ Non-Contact Dispense Valve | Fluid Dispensing Nordson EFD Corporate | Global Directory | Languages Division Only All of Nordson Home Products Accessories
PCB Libraries, Inc. | https://www.pcblibraries.com/Products/FPX/Xpedition.asp
– Products with a moderate level of component density may consider adapting the 'median' land pattern geometry. The median land patterns furnished for all device families will provide a robust solder attachment condition for reflow solder processes and should provide a condition suitable for wave or reflow
