Industry Directory | Manufacturer
As trends towards the miniaturization and increased functional integration of electronics, the demands on quality assurance are rising. FISCHER has many coating thickness measurement solutions for the electronics sector.
Industry Directory | Consultant / Service Provider / Manufacturer
One of the major suppliers of stencils and pallets to the SMT industry. Stentech offers Electroformed and laser cut stencils, pallets and fixtures.
Our Preco FlexPro CNC laser cutting system provides the speed of galvanometer processing with all the versatility of an XY motion system. Orion has the capability to cut detailed parts more precisely, and with shorter lead-times than conventional too
New Equipment | Rework & Repair Equipment
BGA Rework Stations from the BGA Experts with over 25 years rework process experience and customer support! For high volume BGA Rework on even the largest computer and networking boards! The model SV560A has a high resolution optical system for pla
Electronics Forum | Tue Aug 17 17:06:43 EDT 2004 | davef
First, we'd like to see your supplier's minimum Sn thickness to be increased to 10um. Look here for support of this position: http://www.psma.com/HTML/FILES/forums/leadfree/hp_ext_pos_sn_for_pbfree.pdf Second, increasing the thickness of tin: * Ra
Electronics Forum | Mon Feb 19 17:34:02 EST 2007 | GS
Thank You Pavel and Dave, Unfortunately I do not have IPC-4554. Anyway I 0.6-1.0umm is what I remember, and confirmed by reading also through leterature available on google. I was just going to understand if it possible to obtain more thickness
Used SMT Equipment | AOI / Automated Optical Inspection
SAKI Desktop AOI BF18D-P40 Inspection Machine Substrate flatness: ±2mm Board size:50 * 60 - 250 * 330mm PCB thickness: 0.6mm - 2.5mm weight::30KG ■ Industry-Leading High Throughput Leading High Throughput The Alternate Color Digital Scanning
Used SMT Equipment | Circuit Board Assembly Products
1, Features: SM-2007 separates both small and large pre-scored PCBs. The table and the rest can be continuously adjusted to the most suitable working position, The slit between the linear blade and the rest can be adjusted to ensure that the side s
Industry News | 2003-02-25 08:18:29.0
Teradyne can now provide deep micro-via technology for customers of high-performance printed circuits.
Industry News | 2003-06-18 08:04:27.0
Recently purchased and installed a new DP-1500-2X Dual-Sided Photoimageable Ink Coater from Circuit Automation
Parts & Supplies | Pick and Place/Feeders
Yamah YV100 II parameter 1. Highways based on the reliability of basic structures 2. Paste of protective elements 3.0.25 seconds / CHIP high-speed mount 4. Can mount 0.5 foot spacing 32mm QFP 5. High Speed Image Processing 6.2 cameras reduced p
Technical Library | 2014-07-02 16:46:09.0
Growth behaviors of intermetallic compounds (IMCs) and Kirkendall voids in Cu/Sn/Cu microbump were systematically investigated by an in-situ scanning electron microscope observation. Cu–Sn IMC total thickness increased linearly with the square root of the annealing time for 600 h at 150°C, which could be separated as first and second IMC growth steps. Our results showed that the growth behavior of the first void matched the growth behavior of second Cu6Sn5, and that the growth behavior of the second void matched that of the second Cu3Sn. It could be confirmed that double-layer Kirkendall voids growth kinetics were closely related to the Cu–Sn IMC growth mechanism in the Cu/Sn/Cu microbump, which could seriously deteriorate the mechanical and electrical reliabilities of the fine-pitch microbump systems
Technical Library | 2012-12-13 21:20:05.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. We investigated the micro-void formation of solder joints after reliability tests such as preconditioning (precon) and thermal cycle (TC) by varying the thickness of Palladium (Pd) in Electroless Nickel / Electroless Palladium / Immersion Gold (ENEPIG) surface finish. We used lead-free solder of Sn-1.2Ag-0.5Cu-Ni (LF35). We found multiple micro-voids of less than 10 µm line up within or above the intermetallic compound (IMC) layer. The number of micro-voids increased with the palladium (Pd) layer thickness. Our results revealed that the micro-void formation should be related to (Pd, Ni)Sn4 phase resulted from thick Pd layer. We propose that micro-voids may form due to either entrapping of volatile gas by (Pd, Ni)Sn4 or creeping of (Pd, Ni)Sn4.
Desktop PCB Depaneling Router Machine with Customized Fixture Desktop PCB Router Features: 1. Bench-top single table PCB router with speeds up to 100mm/s and positioning speeds of 500mm/s. 2. Uninterrupted continuous cutting during loading and u
Separate precise SMD thin board, aluminum PCB, copper PCB, RF4, fiberglass PCB and T5T8 light. For special board ,needs customization. If you have any question, just feel free to contact e-mail: bella@qy-smt.com or browse Website?https://morel-equi
Events Calendar | Wed Apr 19 00:00:00 EDT 2017 - Fri Apr 21 00:00:00 EDT 2017 | Nara, Japan
Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2017)
International Microelectronics Assembly and Packaging Society (IMAPS)
Career Center | Houston, Texas USA | Engineering,Management,Quality Control,Technical Support
Seasoned Process & Quality Engineer. Degreed Chemical Engineer. 20+ years in Electronics Semiconductor manufacturing. Proficient in Quality Statistical tools, Design of Experiments, FMEAs, APQP, PPAP, ISO 9000, ISO/TS 16949 etc.
Career Center | Theni, Tamilnadu India | Engineering
NPI Engineer: • Playing a role as NPI leader of the Telecom, Aerospace & Server Products to introduce and run to qualify the engineering build from customer. • Conducting Weekly NPI meeting with the CFT team to review the progress of the NPI schedu
Influence of Pd Thickness on Micro Void Formation of Solder Joints in ENEPIG Surface Finish SMTnet Express December 13, 2012, Subscribers: 26067, Members: Companies: 9068, Users: 34058 Influence of Pd Thickness on Micro Void Formation of Solder
Imagineering, Inc. | https://www.pcbnet.com/blog/improved-conductive-ink-technology-is-boosting-value-for-all-printed-electronics/
the right application, can help replace bulky and heavier applications. Conductive inks and pastes may also be layered upon a substrate to reduce weight and thickness, but increase the flexibility of the finished product
1st Place Machinery Inc. | http://www.firstplacemachinery.com/first_place_smt_pcb_test_xray_faxitronxray.html
: 30 to 100 uA X-Ray Beam Divergence: 40 degrees Beryllium Window thickness: 127 um Detector: High resolution X-Ray Image Intensifier with input field size = 4 inches (100 mm) Camera
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