Advanced Multilayer Interconnect Technology. Manufacture high I/Os substrates for high speed and high frequency packaging devices. Utilizing thin films technologies
Industry Directory | Equipment Dealer / Broker / Auctions
SemiconSoft offers the premier supply of thin-film thickness measurement and information analysis software package.
New Equipment | Rework & Repair Equipment
BEST HotDots™ are designed to simply and cleanly attach jumper wires on a board. HotDots™ are built to survive at high temperature as both the adhesive and the polyimide material are designed to withstand wash and reflow temperatures. HotDots™ are a
New Equipment | Rework & Repair Equipment
The BEST PCB pad repair repair kit gives you the tools you need for fast modification and repair of PCB circuit pads-no matter what their size. Our online PCB repair training videos, our master instructors along with these materials allows you to mee
Used SMT Equipment | Pick and Place/Feeders
Universal Instruments GSMxs Advanced Semiconductor and SMT Pick and Place Machine Model 5785A Very Low Cycle Counter only 723,974 Cycles. UPS+ 6.1.0.5 Software Unovis ASA, Windows OS Linear Motor Technology Four Spindle C4
Industry News | 2003-04-15 08:57:18.0
First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies
Industry News | 2003-03-24 09:46:41.0
Will feature a number of new technologies of interest to fabricators in printed circuit materials, laminate materials, polymer thick films and, most notably, its newest product line of embedded passive materials, DuPont Interra�.
Technical Library | 2023-09-07 14:54:10.0
A global manufacturer of a broad line of electronic interconnect solutions worked with us to dispense conductive adhesive EpoTek H20E-FC. EpoTek H20E-FC is a two-component, electrically conductive, snap curing epoxy for photovoltaic thin film module stringing, semiconductor packaging and PCB circuit assembly. The primary goal was filling a rectangular cavity on a connector. The epoxy needed to fill the connector to the top of the walls in less than three seconds.
Technical Library | 2013-07-03 10:31:54.0
It has been demonstrated in numerous pieces of work that stencil printing, one of the most complex PCB assembly processes, is one of the largest contributors to defects (Revelino et el). This complexity extends to prototype builds where a small number of boards need to be assembled quickly and reliably. Stencil printing is becoming increasingly challenging as packages shrink in size, increase in lead count and require closer lead spacing (finer pitch). Prototype SMT assembly can be further divided between industrial and commercial work and the DIYer, hobbyist or researcher groups. This second group is highly price sensitive when it comes to the materials used for the board assembly as their funds are sourced from personal or research monies as opposed to company funds. This has led to development of a lower cost SMT printing stencil made from plastic film as opposed to the more traditional stainless steel stencil used by industrial and commercial users.This study compares the performance of these two traditional materials and their respective impact on solder paste printing including efficiency and print quality.
This video demonstrated the use of BEST Inc HotDots(TM) which allow wires to be affixed to the PCB or other surfaces-even when those surfaces go through reflow. There are other similar products out there but none of which can be readily customized no
This video is on the dry film pad repair technique per IPC 7721 standards. BEST professional instructors demonstrate the proper technique for the repair for PCB pads using the dry film. http://www.solder.net More on PCB pad repair here: http://www.s
Events Calendar | Wed Apr 27 18:30:00 UTC 2022 - Wed Apr 27 18:30:00 UTC 2022 | ,
Joint Silicon Valley/Ohio Valley Chapter Webinar: Automation & the Journey to the Smart Factory
Events Calendar | Tue Mar 17 18:30:00 UTC 2020 - Tue Mar 17 18:30:00 UTC 2020 | College Park, Maryland USA
CALCE Reliability Science Symposium - Spring 2020
Career Center | Boulder, Colorado USA | Engineering,Production,Quality Control
Senior-level micro-electronic technician capable of independent manufacture of custom hybrids, focal plane assemblies, and prototype detector assemblies in cleanroom environment (in Advanced Packaging and Detector Laboratory). MINIMUM QUALIFICATIONS
Career Center | , | Engineering
We need someone who has been a microwave thin film technician or engineer who has actually tuned thin film circuits. We need someone who can explain the tuning process in broad concepts and has the ability to demonstrate those concepts (i.e. what d
Career Center | Upton, New York USA | Engineering,Production,Research and Development
Experienced in x-ray reflectrometry and diffraction characterization of semiconductor layered materials, wavelength dispersive x-ray spectroscopy analysis of materials, x-ray scattering analysis of thin films surface and interface Experienced in d
Career Center | Atkinson, New Hampshire USA | Maintenance,Production,Technical Support
14 years experience maintaining very large scale and high output thin film, through hole and SMT production lines utilizing the ISO9001 standards of quality.
ORION Industries | http://orionindustries.com/pdfs/kapton.pdf
leading edge of the new film on the bottom for universal and Step-Pac™ put-ups. Pad put-ups of one- or two-side FEP composites have the leading edge of the new film on the top. 7 Packaging and Marking Packaging Kapton® polyimide film shall be adequately
KingFei SMT Tech | http://www.smtspare-parts.com/sale-8491085-thin-round-smt-feeder-parts-40081795-8mm-juki-feeder-wheel-ring-03.html
Thin Round SMT Feeder Parts 40081795 8mm JUKI Feeder Wheel Ring 03 Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
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