Industry Directory: thin laminate (5)

Mica-AVA (Far East) Industrial Ltd

Industry Directory | Manufacturer

Mica-AVA (Far East) Industrial Ltd (MAF) cooperate with Hitachi Chemicals manufactures high reliability, high-quality and quick-turn laminate FR4 products (Normal, High Tg and Halogen free)

Sheldahl, Inc.

Industry Directory | Manufacturer

Manufacturers flexible printed circuits, circuit materials, IC packaging substrates, laminates, conductive coatings and tapes

New SMT Equipment: thin laminate (12)

EMI/RFI Shielding Laminates

EMI/RFI Shielding Laminates

New Equipment | Materials

To shield against emissions, there must be a barrier of an electrical conductive material. Shielding laminates provide an economical and effective solution to this problem. Most of our materials consist of a metal foil (usually, copper or aluminum)

ORION Industries

FISCHER SR-SCOPE®

FISCHER SR-SCOPE®

New Equipment | Test Equipment

Measurement of copper thickness on printed circuit boards. Non-destructive, fast, accurate, and without influence from opposing copper layers. The SR-SCOPE®‚ coating thickness gauge measures the thickness of copper coatings on the top side of pc-bo

Fischer Technology, Inc.

Electronics Forum: thin laminate (46)

Very thin laminate substrate problem with solder printing

Electronics Forum | Mon Jan 30 15:32:14 EST 2017 | davef

so, why are your laminates warped? What needs to be done to correct that issue?

Very thin laminate substrate problem with solder printing

Electronics Forum | Mon Jan 30 19:29:50 EST 2017 | swag

Tacsil is another product you might try.

Industry News: thin laminate (48)

Rogers Corp. Introduces R/flex� 3850 Bi-Clad Liquid Crystalline Polymer Material for Multi-layer Thin-Film PCB Construction

Industry News | 2003-06-24 08:14:51.0

R/flex� 3850 laminate is produced in a range of copper and LCP thicknesses, just as the single-clad laminate, and is available in standard panel formats.

SMTnet

DuPont Electronic Technologies Highlights Interra� Embedded Passives Technology at IPC Expo

Industry News | 2003-03-24 09:46:41.0

Will feature a number of new technologies of interest to fabricators in printed circuit materials, laminate materials, polymer thick films and, most notably, its newest product line of embedded passive materials, DuPont Interra�.

SMTnet

Technical Library: thin laminate (2)

Factors Affecting the Adhesion of Thin Film Copper on Polyimide

Technical Library | 2017-11-22 12:38:51.0

The use of copper foils laminated to polyimide (PI) as flexible printed circuit board precursor is a standard practice in the PCB industry. We have previously described[1] an approach to very thin copper laminates of coating uniform layers of nano copper inks and converting them into conductive foils via photonic sintering with a multibulb conveyor system, which is consistent with roll-to-roll manufacturing. The copper thickness of these foils can be augmented by electroplating. Very thin copper layers enable etching fine lines in the flexible circuit. These films must adhere tenaciously to the polyimide substrate.In this paper, we investigate the factors which improve and inhibit adhesion. It was found that the ink composition, photonic sintering conditions, substrate pretreatment, and the inclusion of layers (metal and organic) intermediate between the copper and the polyimide are important.

Intrinsiq Materials Inc.

Copper/Epoxy Joints in Printed Circuit Boards: Manufacturing and Interfacial Failure Mechanisms

Technical Library | 2020-01-09 00:00:30.0

PCBs have a wide range of applications in electronics where they are used for electric signal transfer. For a multilayer build-up, thin copper foils are alternated with epoxy-based prepregs and laminated to each other. Adhesion between copper and epoxy composites is achieved by technologies based on mechanical interlocking or chemical bonding, however for future development, the understanding of failure mechanisms between these materials is of high importance. In literature, various interfacial failures are reported which lead to adhesion loss between copper and epoxy resins. This review aims to give an overview on common coupling technologies and possible failure mechanisms. The information reviewed can in turn lead to the development of new strategies, enhancing the adhesion strength of copper/epoxy joints and, therefore, establishing a basis for future PCB manufacturing.

Polymer Competence Center Leoben GmbH

Express Newsletter: thin laminate (173)

SMTnet Express - November 22, 2017

SMTnet Express, November 22, 2017, Subscribers: 31,034, Companies: 10,792, Users: 24,082 Factors Affecting the Adhesion of Thin Film Copper on Polyimide David Ciufo, Hsin-Yi Tsai and Michael J. Carmody; Intrinsiq Materials Inc. The use of copper

Partner Websites: thin laminate (14)

3M Product Summary

ORION Industries | http://orionindustries.com/pdfs/3MPR0DUCTSUMMARY.pdf

3M Product Summary Thin Bonding Adhesive Transfer Tape Click on Product to View Data Page Adhesive PRODUCT LINER Application Description ADHESION TEMP RANGE Family Caliper Type Caliper Metal HSE LSE

ORION Industries

Industrial Laminating Equipment | Nordson

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/applications/laminating?con=t&page=16

a smooth application of laminate on crucial surfaces, while laminating dies ensure leak-free operation. When you need controlled dispersion of industrial laminating

ASYMTEK Products | Nordson Electronics Solutions


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