Industry Directory | Manufacturer
Mica-AVA (Far East) Industrial Ltd (MAF) cooperate with Hitachi Chemicals manufactures high reliability, high-quality and quick-turn laminate FR4 products (Normal, High Tg and Halogen free)
Industry Directory | Manufacturer
Manufacturers flexible printed circuits, circuit materials, IC packaging substrates, laminates, conductive coatings and tapes
To shield against emissions, there must be a barrier of an electrical conductive material. Shielding laminates provide an economical and effective solution to this problem. Most of our materials consist of a metal foil (usually, copper or aluminum)
New Equipment | Test Equipment
Measurement of copper thickness on printed circuit boards. Non-destructive, fast, accurate, and without influence from opposing copper layers. The SR-SCOPE®‚ coating thickness gauge measures the thickness of copper coatings on the top side of pc-bo
Electronics Forum | Mon Jan 21 08:28:33 EST 2013 | proy
I am looking at assembling a relatively small baord, but it is very thin and precise. It is .010" FR4, with 1oz copper two sides. ** Components are only on one side** It has some 0201's and a .4mm pitch BGA among other leadless packages. Where
Electronics Forum | Mon Jan 30 15:32:14 EST 2017 | davef
so, why are your laminates warped? What needs to be done to correct that issue?
Industry News | 2003-06-24 08:14:51.0
R/flex� 3850 laminate is produced in a range of copper and LCP thicknesses, just as the single-clad laminate, and is available in standard panel formats.
Industry News | 2003-03-24 09:46:41.0
Will feature a number of new technologies of interest to fabricators in printed circuit materials, laminate materials, polymer thick films and, most notably, its newest product line of embedded passive materials, DuPont Interra�.
Technical Library | 2017-11-22 12:38:51.0
The use of copper foils laminated to polyimide (PI) as flexible printed circuit board precursor is a standard practice in the PCB industry. We have previously described[1] an approach to very thin copper laminates of coating uniform layers of nano copper inks and converting them into conductive foils via photonic sintering with a multibulb conveyor system, which is consistent with roll-to-roll manufacturing. The copper thickness of these foils can be augmented by electroplating. Very thin copper layers enable etching fine lines in the flexible circuit. These films must adhere tenaciously to the polyimide substrate.In this paper, we investigate the factors which improve and inhibit adhesion. It was found that the ink composition, photonic sintering conditions, substrate pretreatment, and the inclusion of layers (metal and organic) intermediate between the copper and the polyimide are important.
Technical Library | 2020-01-09 00:00:30.0
PCBs have a wide range of applications in electronics where they are used for electric signal transfer. For a multilayer build-up, thin copper foils are alternated with epoxy-based prepregs and laminated to each other. Adhesion between copper and epoxy composites is achieved by technologies based on mechanical interlocking or chemical bonding, however for future development, the understanding of failure mechanisms between these materials is of high importance. In literature, various interfacial failures are reported which lead to adhesion loss between copper and epoxy resins. This review aims to give an overview on common coupling technologies and possible failure mechanisms. The information reviewed can in turn lead to the development of new strategies, enhancing the adhesion strength of copper/epoxy joints and, therefore, establishing a basis for future PCB manufacturing.
SMTnet Express, November 22, 2017, Subscribers: 31,034, Companies: 10,792, Users: 24,082 Factors Affecting the Adhesion of Thin Film Copper on Polyimide David Ciufo, Hsin-Yi Tsai and Michael J. Carmody; Intrinsiq Materials Inc. The use of copper
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/industrial-coating-systems/application-solutions/uv-curing/wood-and-medium-density-fiberboard
Curing Wood and Medium Density Fiberboard Related Information See All Products UV Products Wood and Medium Density Fiberboard Low-cure temperature and UV-curable powder coatings offer a durable, attractive and economical alternative to liquid paints and laminates for finishing wood and MDF
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
., and Gregory Parks Abstract 30-1 3D Wafer Level Packaging by Using Cu-Through Silicon Vias for Thin MEMS Accelerometer Packages L
