Industry Directory | Manufacturer
PWB designs and manufactures test equipment and provides services to test the reliability of Printed Circuit Boards.
STATS ChipPAC is a leading provider of advanced semiconductor packaging and test services to global customers in the communication, consumer and computing markets.
Form & Cut 2-, 3-, 4-, 5-, and 7-leaded Radial Components Capable of forming loose radial components at rates up to 5,000 parts per hour with a variable speed motor. Feed components by hand or with tubes (TO-220s) Reduce setup time with quick ch
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
Electronics Forum | Fri Jun 07 10:46:16 EDT 2019 | gregoryyork
The Single Solder ball stuck to the mask may indicate undercured as well. The issue is not so much the mild No Clean flux but the potentially major active HASL flux or Silver Process chemistries causing issues. This has been through flow solder hasnt
Electronics Forum | Tue Sep 14 14:52:22 EDT 2004 | Carol
During processing, the solder in the vias reflows and forms solder balls. PCBs have solder in random PBGA vias from the board manufacturer.The manufacturer says this is a result of the HASL process and is unavoidable. We use HASL finish, multilayer,
Used SMT Equipment | In-Circuit Testers
Description This product was manufactured by Agilent or Hewlett-Packard many years ago. We provide this page to assist you in using or replacing your product. You can receive free self support via the Agilent website only; technical support is not
Used SMT Equipment | General Purpose Test & Measurement
Description This product was manufactured by Agilent or Hewlett-Packard many years ago. We provide this page to assist you in using or replacing your product. If this product's status is "Discontinued": This product is no longer sold by Agilent, b
Industry News | 2017-06-14 10:46:29.0
GPD Global offers uniquely designed 2-part mixing pump to accurately mix and dispense two-part components while eliminating entrapped air.
Industry News | 2003-02-27 08:22:44.0
Circatex is to open its first satellite office in mainland Europe in France.
Parts & Supplies | Assembly Accessories
Detailed Product Description Features: 7 Channel Brand: KIC Part Name: X5 Reflow Profiler Model: X5 Condition: Original New Leadtime: 7days KIC X5 Thermal Profiler with SPC software and RF capability For Reflow Track More Data Points With 7,
Technical Library | 2020-07-15 18:49:03.0
Via Filling • Through Hole Vias - IPC-4761 – Plugging – Filling – Filled & Capped • MicroviaFilling and Stacked Vias
Technical Library | 2017-08-10 01:23:22.0
This paper demonstrates the high frequency performance and thermo-mechanical reliability of through vias with 25 μm diameter at 50 μm pitch in 100 μm thin glass substrates. Scaling of through via interconnect diameter and pitch has several electrical performance advantages for high bandwidth 2.5D interposers as well as mm-wave components for 5G modules.
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
Training Courses | | | IPC-6012 Specialist (CIS)
The Certified IPC-6012 Specialist (CIS) training covers design, fabrication and inspection of rigid printed boards.
Training Courses | | | IPC-6012 Trainer (CIT)
The Certified IPC-6012 Trainer (CIT) courses recognize individuals as qualified trainers in the area of design, fabrication and inspection of rigid printed boards and prepare them to deliver Certified IPC-6012 Specialist (CIS) training.
Events Calendar | Tue Aug 22 00:00:00 EDT 2023 - Tue Aug 22 00:00:00 EDT 2023 | Boca Raton, Florida USA
Space Coast Panel Discussion: Microscope Setups, Getting the Best Results From Your Equipment
Events Calendar | Tue Jun 04 00:00:00 EDT 2019 - Tue Jun 04 00:00:00 EDT 2019 | Philadelphia, Pennsylvania USA
Quality Adhesive Technologies from LOCTITE - Free Workshop
Career Center | San Jose, California USA | Management
DCSI is one of the most trusted and respected global executive search and solutions companies inthe electronics manufacturing industries. We have more than 35 active openings that range from Managers, Directors, Sr. Directors, Vice Presidents, to EV
Career Center | TULSA, Oklahoma USA | Engineering,Quality Control
This opportunity is with a Global industry leader in the design and manufacturing of sophisticated electronic components and devices for military and commercial markets. Our client company plays a very significant role throughout the world providing
Career Center | Alta Loma, California | Engineering,Quality Control,Research and Development
Rigid and Flexible Printed Circuits Plating and Metal Finishing Operations Six Sigma Work Instruction Documentation Process Development Equipment Selection and Specification New Facility Startup Air, Water and Hazardous Waste Environmental Reporting
Career Center | chennai, India | 2017-04-10 14:51:26.0
Engineering,Maintenance,Production,Research and Development
SMTnet Express, August 10, 2017, Subscribers: 30,696, Companies: 10,656, Users: 23,635 High Frequency Electrical Performance and Thermo-Mechanical Reliability of Fine-Pitch, Copper - Metallized Through-Package-Vias (TPVs) in Ultra - thin Glass
SMTnet Express, June 27, 2019, Subscribers: 32,092, Companies: 10,819, Users: 24,882 Advanced Cu Electroplating Process for Any Layer Via Fill Applications with Thin Surface Copper Credits: MacDermid Inc. Copper-filled micro-vias are a key
| http://www.feedersupplier.com/SMT_THROUGH_HOLE
. Thus, both sides of the boards can be easily utilized for mounting, and there is no need for plated drill holes. For the purpose of connecting traces in the circuit layers, one may use vias instead, which are structurally the same as plated through-holes but much smaller
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/plasma-applications/pcb-manufacturing
. Surface activation for double-sided and multi-layer fluoropolymer through-hole boards is necessary to increase surface wettability. Carbon Removal - Plasma treatment removes carbon from both conventional through-hole board vias and blind vias
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