STATS ChipPAC is a leading provider of advanced semiconductor packaging and test services to global customers in the communication, consumer and computing markets.
Industry News | 2010-12-01 13:54:27.0
The SMTA is pleased to announce plans are now finalized for the 2011 Pan Pac Symposium and Tabletop Exhibition.
Industry News | 2016-08-23 16:25:55.0
The SMTA and Chip Scale Review magazine are pleased to announce the Workshops for the 13th Annual International Wafer-Level Packaging Conference (IWLPC). On Thursday, October 20, there will be professional workshops given by instructors who are pre-eminent authorities in their fields. IWLPC will be held October 18-20, 2016 at the DoubleTree Airport Hotel in San Jose, California.
Technical Library | 2012-02-02 19:09:53.0
A miniaturized wafer-level packaged MEMS acceleration switch with through silicon vias (TSVs) was fabricated, based on technologies suitable for harsh environment applications. The high aspect ratio TSVs were fabricated through the silicon-on-insulator (S
The Foundation for Scientific and Industrial Research - SINTEF
Technical Library | 2010-12-09 20:26:15.0
As demands accelerate for increasing density, higher bandwidths, and lower power, many IC design teams are looking up – to 3D ICs with through-silicon vias (TSVs). 3D ICs promise “more than Moore” integration by packing a great deal of functionality int
SMT Express, Issue No. 5 - from SMTnet.com Volume 1, Issue No. 5 Wednesday, October 13, 1999 Featured Article Return to Front Page A New Light-Weight Electronic Packaging Technology Based On Spray-Formed Silicon-Aluminiumby David M. Jacobson
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/call_for_papers.cfm
) Package on Package (PoP) Photonics Photovoltaics and Solar Reliability Silver Wire-bonding Stacked Die System in Package (SiP) Through Silicon Vias (TSVs
| https://www.eptac.com/faqs/ask-helena-leo/ask/gold-wire-bond-failing-pull-test
. For beam lead devices: (d-1) Silicon broken. (d-2) Beam lifting on silicon. (d-3) Beam broken at bond. (d-4) Beam broken at edge of silicon. (d-5
