New Equipment | Cable & Wire Harness Equipment
Low Cost Table Top Crimp Machine. The C 200 is a table top low cost crimp tool which takes a variety of dies from different manufacturers. Air operated using standard factory air (5 bar min), with a pressing capacity of up to 1,200 kp, this portable
4.jpg)
New Equipment | Industrial Automation
Sandy.[mailto:unity@mvme.cn] Sandy.[WhatsApp/Skype/Mobile:+8618020776786] Sandy.[Quote to you within the shortest possible time with our best price] Warranty: up to 12 months Shipping: fast delivery is available NEW+ORIGINAL+IN STOCK+ONE
Electronics Forum | Sun Apr 19 11:19:52 EDT 2020 | davef
A-610G 7.5.16 Components with Bottom Thermal Plane Terminations (D-Pak) says: 100% wetting to land in the end-joint contact area. Is that what you're asking about? Regards, David Fish [davef] Technical Editor & Customer Advocate
Electronics Forum | Fri Nov 23 16:09:01 EST 2007 | davef
We're not real clear about what you're trying to discuss, because most capacitors are packaged in epoxy with a solderable termination on each end. But lets throw a couple of ideas at the wall and see what sticks. If this epoxy is: * From the capaci
Used SMT Equipment | Soldering - Selective
Juki Cube 460 Selective Solder system Don't miss out on this opportunity to own this Excellent Selective Soldering Machine the Juki CUBE-460 Year 2022 ! The Juki Cube 460 is the most accessible selective solder that allows for easy setup & easy maint
Industry News | 2016-09-15 18:08:04.0
Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place October 25-27, 2016 at Hyatt Rosemont, Rosemont, Illinois. The conference is focused on best practices for designing, cleaning and coating highly dense electronic assemblies to assure reliability in today’s mobile society.
Industry News | 2018-04-11 20:04:01.0
SMTA Europe announces Session 3 Technical Program on Advanced Test Methods at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Parts & Supplies | Pick and Place/Feeders
We also supply following JUKI spare parts: 40000403 ADJUST BOLT 40000404 ADJUST BOLT(EN) 40000405 CASTER 40000411 Y-AXIS SENSOR BR ASSY 40000413 FEEDER FLOAT_SENS ASSY 40000414 FEEDER_SENS ASSY 40000419 CONTROL UNIT(60) 40000431 PANEL
1.jpg)
Parts & Supplies | Pick and Place/Feeders
Supply original new filter for juki m/c JUKI 750/760 filter Part Number:E79167250A0,E7917725000 JUKI 2010/2020/2030/2040/2050/2055/2060/FX-1/FX-1R/FX-3 filter Part Number:E3052729000 JUKI 2070/2080 filter Part Number:40046646 Supply all
Technical Library | 2018-09-26 20:33:26.0
Bottom terminated components, or BTCs, have been rapidly incorporated into PCB designs because of their low cost, small footprint and overall reliability. The combination of leadless terminations with underside ground/thermal pads have presented a multitude of challenges to PCB assemblers, including tilting, poor solder fillet formation, difficult inspection and – most notably – center pad voiding. Voids in large SMT solder joints can be difficult to predict and control due to the variety of input variables that can influence their formation. Solder paste chemistries, PCB final finishes, and reflow profiles and atmospheres have all been scrutinized, and their effects well documented. Additionally, many of the published center pad voiding studies have focused on optimizing center pad footprint and stencil aperture designs. This study focuses on I/O pad stencil modifications rather than center pad modifications. It shows a no-cost, easily implemented I/O design guideline that can be deployed to consistently and repeatedly reduce void formation on BTC-style packages.
QFN stenicl bumping process demonstrated using a polyimide stencil. This process is one in which a stencil is used to the bump the bottom terminations of a leadless device making it simple to place without voiding of the the thermal pac or shorting o
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Wed Apr 21 00:00:00 EDT 2021 - Wed Apr 21 00:00:00 EDT 2021 | ,
Oregon Chapter Tutorial: How Clean is Clean and How Do You Know for Sure?
Events Calendar | Mon Oct 07 00:00:00 EDT 2019 - Tue Oct 08 00:00:00 EDT 2019 | ,
PCBA Cleanliness End-of-Project Webinar
SMTnet Express, September 27, 2018, Subscribers: 31,354, Companies: 11,055, Users: 25,237 Assessing the Effectiveness of I/O Stencil Aperture Modifications on BTC Void Reduction Carlos Tafoya, Gustavo Ramirez, Timothy O'Neill; AIM Solder Bottom
GPD Global | https://www.gpd-global.com/co_website/conformal-simplecoat-features.php
& Unloader System Selection Conformal Coating Machines Selective Coating Machines -SimpleCoat Selective Coating with Tilt-&-Rotate -SimpleCoat TR Pumps Pumps for Integration Precision Auger Pump Jetting Pump - NCM5000 Volumetric Pump - PCD Time Pressure Dispensing Pump Selection Pump Accessories Precision Nozzles S Type
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/industries/mems?page=7
Us Support Suppliers Resources Careers Home Industry MEMS MEMS Manufacturing Applications Discover how Nordson equipment can enhance MEMS fabrication processes Fast, precise dispensing, tilt
winsouce.jpg)
