Industry News: tin 2,300 (3)

IPC Solder Products Value Council, Solectron, Flextronics and U.S. NAVSEA Begin Reliability Test Program on Lead-Free Solder

Industry News | 2003-06-11 08:00:48.0

IPC has begun a comprehensive study of the three leading lead-free alloys (Tin-Silver-Copper) in an effort to analyze the properties of the leading candidates for lead-free assembly.

Association Connecting Electronics Industries (IPC)

Next Edition of IPC Publications Catalog Released

Industry News | 2003-08-27 10:43:02.0

This 41-page document is the complete source for printed circuit board and electronics assembly standards and publications for design, materials, manufacturing, assembly, quality and test.

Association Connecting Electronics Industries (IPC)

Express Newsletter: tin 2,300 (158)

SMTnet Express - August 1, 2019

SMTnet Express, August 1, 2019, Subscribers: 32,197, Companies: 10,845, Users: 24,998 Tin Whiskers: Risks with Lead Free | Part I Credits: ACI Technologies, Inc. Tin (Sn) metal displays the characteristic of growing "tin whiskers" from pure tin

Effects of Tin and Copper Nanotexturization on Tin Whisker Formation

Effects of Tin and Copper Nanotexturization on Tin Whisker Formation SMTnet Express August 17, 2012, Subscribers: 25395, Members: Companies: 8952, Users: 33485 Effects of Tin and Copper Nanotexturization on Tin Whisker Formation First published


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