Hallmark Metals Corp. A premier leader in the CASTING ALLOY and SOLDER Industry. Sellers of Tin, Bismuth, Low melt alloys, Pewter sheet, Antimony, Hard and Soft lead, Babbit, Custom alloys, Zinc alloys, Cadmium,
Torrey S. Crane manufactures a complete line of industrial solders ranging from pure tin and lead with alloys with silver,bismuth,antimony,and cadmium.Crane solders meet and exceed J-STD-006,QQS-571and ASTM B32 standards and are ISO 9002 CERTIFIED
New Equipment | Solder Materials
Solder Wire from the Indium Corporation is made to demanding quality standards. Our flexible manufacturing process allows us to fulfill orders from evaluation/research quantities to full scale production volumes. Indium Solder Wire Diameters We m
New Equipment | Solder Materials
SN100C is a lead-free solder alloy developed by Nihon Superior in Japan that is comprised of tin-copper-nickel + germanium. SN100C offers user-friendly properties and has been proven in commercial production since 1999. The result of these advantages
Electronics Forum | Tue Feb 27 18:16:42 EST 2001 | davef
I have never seen excess tin [heard of it, just never seen it]. Excess lead yes, but tin no. See, tin oxidizes faster than lead. This means that dross has a higher tin content than the solder in the pot. So, with a very high dross machine, we regul
Electronics Forum | Mon Dec 12 14:04:33 EST 2005 | craigj
Hi All was wondering is there anything I should be aware of or look out for if using parts with SnBi (Pb free) lead plating with Sn/Pb/Ag solder paste? I was always lead to believe that mixng lead and bismuth caused problems or are the bismuth levels
Industry News | 2019-08-08 22:35:07.0
The SMTA is pleased to announce three inspiring keynote presentations scheduled during SMTA International 2019. Adam Steltzner, Ph.D., NASA, will keynote SMTA International the morning of Tuesday, September 24 with his presentation “The Right Kind of Crazy: A True Story of Teamwork, Leadership and High Stakes Innovation.” Adam will share the challenges he faced leading the landing team for NASA’s Curiosity Rover on its mission to Mars. The lessons learned from those struggles illustrate how to better lead high performing teams, manage innovation and drive towards excellence.
Industry News | 2011-08-18 21:23:09.0
For an industry that is constantly advancing, the technical conference at IPC Midwest Conference & Exhibition on September 21–22, in Schaumburg, Ill., will feature five sessions offering the latest research, methodologies and insights from industry experts to address critical challenges of manufacturing defect-free, quality electronics.
Technical Library | 2013-01-24 19:16:35.0
The electronics industry has mainly adopted the higher melting point Sn3Ag0.5Cu solder alloys for lead-free reflow soldering applications. For applications where temperature sensitive components and boards are used this has created a need to develop low melting point lead-free alloy solder pastes. Tin-bismuth and tin-bismuth-silver containing alloys were used to address the temperature issue with development done on Sn58Bi, Sn57.6Bi0.4Ag, Sn57Bi1Ag lead-free solder alloy pastes. Investigations included paste printing studies, reflow and wetting analysis on different substrates and board surface finishes and head-in-pillow paste performance in addition to paste-in-hole reflow tests. Voiding was also investigated on tin-bismuth and tin-bismuth-silver versus Sn3Ag0.5Cu soldered QFN/MLF/BTC components. Mechanical bond strength testing was also done comparing Sn58Bi, Sn37Pb and Sn3Ag0.5Cu soldered components. The results of the work are reported.
Technical Library | 2012-10-23 14:25:38.0
Tin-Silver-Copper alloys are the primary choice for lead-free SMT assembly. Although there are other options available such as alloys containing bismuth or indium and other elements, tin-silver-copper solders, also known as SAC alloys are by far the most popular. They are used by approximately 65% of users, as last surveyed by Soldertec in 2003.
SMTnet Express January 24, 2013, Subscribers: 26136, Members: Companies: 9096, Users: 34208 An investigation into low temperature tin-bismuth and tin-bismuth-silver lead-free alloy solder pastes for electronics manufacturing applications
Advantages of Bismuth-based Alloys for Low Temperature Pb-Free Soldering and Rework SMTnet Express December 20, 2012, Subscribers: 26064, Members: Companies: 9072, Users: 34080 Advantages of Bismuth-based Alloys for Low Temperature Pb
Blackfox Training Institute, LLC | https://www.blackfox.com/blog/guide-to-a-successful-lead-free-soldering/
. Which alloys and fluxes are suitable for lead free hand soldering ? One disadvantage of lead-free solder is that it is not available in wire form, as some alloys, such as tin bismuth, are difficult to pull into wire. Tin-silver-copper (SAC
40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200609010628
Surface Mount Technology Association (SMTA)
