New Equipment | Solder Materials
With a composition of 62% Tin / 36% Lead / 2% Silver, Kapp Electric Eutectic is a cost effective eutectic electrical/electronic solder where Lead is permissible. Silver increases the strength and vibration resistance of the joint in higher stress app
Electronics Forum | Mon Jul 24 11:35:42 EDT 2006 | Jimk@ics-inc.org
We have experienced a problem with tin leaching or discoloration of lead terminals on random parts on solder side of a paste/paste operation. The profile has been used on previous production runs and there doesn't appear to be any heat damage to othe
Electronics Forum | Thu Jul 27 07:50:35 EDT 2006 | davef
Send us pix
Industry News | 2010-04-30 18:47:15.0
SMTA China announces that it presented awards for the 10 best papers/presentations and two best exhibits at the SMTA China East 2010 Conference Award Presentation Ceremony, held on Wednesday, April 21, 2010 at the Shanghai Everbright International Hotel in conjunction with the SMTA China Annual Breakfast Reception.
Industry News | 2022-09-05 06:57:52.0
KYZEN will exhibit at The Battery Show, from Sept. 13-15, 2022 at the Suburban Collection Showplace in Novi, Michigan. The KYZEN team will highlight both AQUANOX and METALNOX product lines, with AQUANOX A4626, METALNOX M6355 and M6386 taking the center stage.
Technical Library | 2014-06-23 14:50:52.0
It was unusual to see chip terminations change colors when tin lead solders were used but with the introduction of lead free reflow soldering and the corresponding increases in reflow temperatures terminations are now changing colors. Two conditions are present when reflow temperatures are increased for lead free solder alloys that leads to discoloration. Reflow temperatures are above the melting point of tin (Sn MP is 232oC). Air temperatures commonly used in forced convection reflow systems are high enough to both melt the tin plating on the termination allowing it to be pulled into the solder joint due to solder joint liquid solder surface tension leaving behind the exposed nickel barrier. Now those metal oxide colors will be visible due to high air temperatures during reflow.
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40 to 60 seconds. As a result, the profile for lead-free reflow tends to differ from the typical tin/lead profile. Instead of rising to a relatively sharp peak
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/00600-228.pdf
. Nitrogen also may reduce discoloration caused by the higher temperatures and longer reflow times for lead-free pastes. Additionally, because lead-free joints tend to be duller than tin/lead joints, nitrogen can improve their appearance
