Electronics Forum: tin issue frame seho solder (11)

Micro Leadless Frame - solder wetting control

Electronics Forum | Wed May 08 23:18:58 EDT 2002 | ianchan

Hi mates, have this SMT production issue : A) We have a leadless-chip-carrier(LCC) IC package that is classified under the Land-Grid-Array(LGA) package family. B) The LCC is 4mm x 4mm, and has 28 tin plated pads located beneath the outside perimet

Soldering issues lately!!

Electronics Forum | Thu Sep 11 11:34:52 EDT 2008 | patrickbruneel

Interesting observation Manuel. I will be blamed again for crying wolf but look below a lot more defects will soon see the daylight all related to lead-free. This information was posted at the tin whisker forum by Bob Landman of H&L Instruments.

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Express Newsletter: tin issue frame seho solder (1119)

SMTnet Express - June 4, 2020

SMTnet Express, June 4, 2020, Subscribers: 28,870, Companies: 11,016, Users: 25,851 Lead-Free Control Plan Credits: ACI Technologies, Inc. A commercial systems manufacturer working on a major defense program had an issue of failed parts during

SMTnet Express - June 4, 2020

SMTnet Express, June 4, 2020, Subscribers: 28,870, Companies: 11,016, Users: 25,851 Lead-Free Control Plan Credits: ACI Technologies, Inc. A commercial systems manufacturer working on a major defense program had an issue of failed parts during


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