New Equipment | Soldering - Other
ASCEN solder dross separator used in the PCB electronic industry,it is designed to recover pure tin and solder dross from working impurities oxides generated from the wave soldering with lead or lead free process.This tin slag recycling machine not o
New Equipment | Solder Materials
Solder dross has gone from being a cost to be considered by large companies to a very high cost that must be tracked for all who assemble electronic devices.As much as 70% of bar solder can be wasted as solder dross and with SAC 305 now at the $25/Lb
Electronics Forum | Fri Oct 13 10:35:06 EDT 2006 | patrickbruneel
I just hope that lead-free alloys will only be used in tropical climates and above 13 C. Check here: http://materials.open.ac.uk/srg/srg_tp.htm Patrick
Electronics Forum | Fri Oct 13 11:55:23 EDT 2006 | patrickbruneel
I just hope that lead-free alloys will only be used in tropical climates and above 13 C. Check here: http://materials.open.ac.uk/srg/srg_tp.htm Patrick
Industry News | 2018-10-18 09:25:57.0
about wave soldering machine tin pot
Industry News | 2010-11-29 17:46:48.0
With many new legislators coming to Washington, it is a critical time to support ongoing efforts to strengthen the U.S. electronics manufacturing industry. To that end, IPC will hold the IPC Summit on American Competitiveness, February 1–2, 2011, in Washington, D.C.
Technical Library | 2013-07-18 12:12:40.0
Lead-free nanosolders have shown promise in nanowire and nanoelectronics assembly. Among various important parameters, melting is the most fundamental property affecting the assembly process. Here we report that the melting behavior of tin and tin/silver nanowires and nanorods can be significantly affected by the surface oxide of nanosolders.
Department of Chemical Engineering, University of Massachusetts
Technical Library | 2016-05-26 15:07:36.0
The oxide layers are known as wetting inhibitors in component and PCB metallizations. The oxide acts as barrier that prevent the tin diffusion from happening. Besides, in corrosion studies, the role of salt residues -with Cl ion- on some metals is known as being promoters of oxidation or corrosion. On the other hand, most of corrosion studies with tin metallization are focused mainly on the corrosion resistance of tin alloys, but little has been done respecting to the influence of salts on tin metallization wetting. In this paper, a series of experiments was carried over to know the influence of specifically NaCl on BGA wetting given Head in Pillow (HiP) as result.
Career Center | Houston, Texas USA | Engineering,Management,Quality Control,Technical Support
Seasoned Process & Quality Engineer. Degreed Chemical Engineer. 20+ years in Electronics Semiconductor manufacturing. Proficient in Quality Statistical tools, Design of Experiments, FMEAs, APQP, PPAP, ISO 9000, ISO/TS 16949 etc.
SMTnet Express July 18, 2013, Subscribers: 26169, Members: Companies: 13430, Users: 34947 Effect of Surface Oxide on the Melting Behavior of Lead-Free Solder Nanowires and Nanorods by Fan Gao, Karunaharan Rajathurai, Qingzhou Cui, Guangwen Zhou
Heller Industries Inc. | https://hellerindustries.com/intermetallics-growth/
Intermetallic Growth on PCB - Heller Home » Intermetallic Growth on PCB Re-printed in partnership with ITM Intermetallic Growth on PCB Where the tin-lead solder adheres to the copper of the lead (from plating) and to the pad
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Intermetallic Growth on PCB-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Reflow oven,SMT Reflow Soldering Oven 当前位置: Home >> News >> News Intermetallic Growth on PCB Intermetallic Growth on PCB Where the tin-lead solder adheres to the copper of the lead
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