Industry Directory | Consultant / Service Provider / Manufacturer / Manufacturer's Representative
ChangDa was founded in 2001, it is a comprehensive company that engaged in R&D, production and marketing of thermal insulation and ESD reinforced plastics.
Industry Directory | Manufacturer
Our products had been widely used in mechanical and electronic industries, etc. Our main products include: 1. Diwei Stone wave solder pallet material: with black, gray, blue and red colors, etc. 2. Glass Fibre pallet: 3241 semiconductor pallet, epoxy pallet, lead-free pallet, insulating pallet, high temperature resistance pallet, copper clad pallet, linen face pallet, etc. Looking forward to
New Equipment | Assembly Services
PNC Inc. has been manufacturing hi-reliability printed circuit boards since 1968. All Military Spec PC boards are manufactured in the security of our Nutley NJ, USA facility. PNC is certified by the Department of Defense to Military Performance Speci
1-22 Layers PCBs FR-4, Rogers, High Tg FR4, CEM-1, CEM-3, etc. Material 0.4-6.0 mm Board Thickness Lead Free HASL, ENIG, Immersion Tin, Immersion Silver, OSP etc. Treatment Green, Red, White, Yellow, Black, Blue Solder Mask
Electronics Forum | Tue Mar 01 10:21:55 EST 2005 | davef
IPC Plating Committee is presently working on a specification for immersion tin [IPC-4554 Specification for Immersion Tin Plating for Printed Circuit Boards] as a solderable surface finish. Immersion tin is normally deposited at 30 to 60 microinches.
Electronics Forum | Thu Nov 19 13:49:00 EST 2009 | bricke
We have been manufacturing a part using bright electrolytic tin as the finish. Our customer has been hand soldering using 63/37. They have recently switched to SN96 and have been experiencing solderability issues. We have sent samples to an outside
Used SMT Equipment | Soldering - Wave
We are looking for overseas distributor / agent for our range of lead free wave soldering machines .The machine includes the following main features: Spray Fiuxer: 1) Oriental motor drives the flux spraying system. Spraying speed is adjusted accordi
Industry News | 2003-06-13 09:56:46.0
Wire and spring specialist William Hughes can now offer three different versions of its PCB test point - small, large and long-legged in quantities suitable for prototype work or volume production.
Industry News | 2012-10-05 16:48:23.0
IPC — Association Connecting Electronics Industries® announces that Jasbir Bath of Bath and Associates Consultancy LLC, has joined the staff on a project basis as a principal engineer within IPC’s assembly technology area.
Technical Library | 2018-03-05 11:17:31.0
In order to comply with RoHS and WEEE directives, many circuit assemblers are transitioning some or all of their soldering processes from tin-lead to lead-free within the upcoming year. There are no drop-in replacement alloys for tin-lead solder, which is driving a fundamental technology change. This change is forcing manufacturers to take a closer look at everything associated with the assembly process: board and component materials, logistics and materials management, solder alloys and processing chemistries, and even soldering methods. Do not expect a dramatic change in soldering behavior when moving to lead-free solders. The melting points of the alloys are higher, but at molten temperatures the different alloys show similar behaviors in a number of respects. Expect subtler changes, especially near the edges of a process window that is assumed based on tin-lead experience rather than defined through lead-free experimentation. These small changes, many of them yet to be identified and understood, will manifest themselves with lower assembly yields. The key to keeping yields up during the transition to lead-free is quickly learning what and where the subtle distinctions are, and tuning the process to accommodate them.
Technical Library | 2020-10-27 02:07:31.0
For companies that choose to take the Pb-free exemption under the European Union's RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products, there is a growing concern about the lack of Sn-Pb ball grid array (BGA) components. Many companies are compelled to use the Pb-free Sn-Ag-Cu (SAC) BGA components in a Sn-Pb process, for which the assembly process and solder joint reliability have not yet been fully characterized. A careful experimental investigation was undertaken to evaluate the reliability of solder joints of SAC BGA components formed using Sn-Pb solder paste. This evaluation specifically looked at the impact of package size, solder ball volume, printed circuit board (PCB) surface finish, time above liquidus and peak temperature on reliability. Four different BGA package sizes (ranging from 8 to 45 mm2) were selected with ball-to-ball pitch size ranging from 0.5mm to 1.27mm. Two different PCB finishes were used: electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) on copper. Four different profiles were developed with the maximum peak temperatures of 210oC and 215oC and time above liquidus ranging from 60 to 120 seconds using Sn-Pb paste. One profile was generated for a lead-free control. A total of 60 boards were assembled. Some of the boards were subjected to an as assembled analysis while others were subjected to an accelerated thermal cycling (ATC) test in the temperature range of -40oC to 125oC for a maximum of 3500 cycles in accordance with IPC 9701A standard. Weibull plots were created and failure analysis performed. Analysis of as-assembled solder joints revealed that for a time above liquidus of 120 seconds and below, the degree of mixing between the BGA SAC ball alloy and the Sn-Pb solder paste was less than 100 percent for packages with a ball pitch of 0.8mm or greater. Depending on package size, the peak reflow temperature was observed to have a significant impact on the solder joint microstructural homogeneity. The influence of reflow process parameters on solder joint reliability was clearly manifested in the Weibull plots. This paper provides a discussion of the impact of various profiles' characteristics on the extent of mixing between SAC and Sn-Pb solder alloys and the associated thermal cyclic fatigue performance.
I.C.T Provide SMT Production Line solutions with Automated Optical Inspection (AOI) AOI is short for Automated Optical Inspection, which is widely used in the electronics industry to check the appearance of PCBA assembly at the back end of the cir
1200MM/1500MM Online SPI , Big Size Solder Paste Inspection Machine mail: sales@smtlinemachine.com whatapp/wechat:+8613537875415 Specification: 技术参数/Parameters 技术平台/Technology Platform super big size platform 适用
Career Center | Sta. Rosa, Manila Philippines | Technical Support
I am in the field of smt equipment for 15 years already and at present i am working as a Service Engineer for High Speed mounter machines . Our Company is solly Sales & Service providers of all pcb assembly and semiconductor equipment. I do inter
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/call_for_papers.cfm
) Tin Whiskers Wafer Level Packaging (WLP) Assembly: 01005/03015 Components/Assembly 3D Board Assembly Additive Manufacturing SMT Adhesives Alternate Solder Alloys BGA/CSP Assembly Bottom Terminated Components Cavity Board Assembly Cleaning, Conformal
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote-usa/?cpn=1
. PCB Specifications View Matrix Part Number * Revision Quantity * Thickness 0.062" Layers * Select One 2 4 Dimensions * Materials FR4(130Tg) FR4(180Tg) from Taiwan or China Copper Weight 1 oz 4 oz Cu from Taiwan or China Finish Plating Leaded Solder ENIG2U"-5U
