Industry Directory: tin whisker risk management (2)

Verdant Electronics

Industry Directory | Manufacturer

Pioneers in the area of solderless assembly technology and originators of the OCCAM process. Developing IP for next and future generations of high reliability and better performing electronic products.

Rosebud Electronics Integration Corp.

Industry Directory | Consultant / Service Provider / Manufacturer

U.S. based contract manufacturer providing turn-key EMS solutions to defense and commercial OEM's.

Electronics Forum: tin whisker risk management (8)

NASA-UA report update

Electronics Forum | Mon Oct 03 10:41:57 EDT 2011 | patrickbruneel

Some of us here attended the 5th CALCE international symposium on tin whiskers http://www.calce.umd.edu/symposiums/ISTW2011.htm where one of my former professors, Dr. Henning Leidecker, talked about the tin whiskers he and the others at NASA Godda

lead free pcb plating?

Electronics Forum | Sat Jul 28 08:37:52 EDT 2007 | davef

There is no good choice. Board Finishes: Industrial/Battelle Class 3 Environment [Reliability Knowledge Gaps: For use of Pb-free solders in High Reliability Applications, J Smetana, iNEMI Availability of SnPb-Compatible BGAs Workshop, March 1, 2007,

Industry News: tin whisker risk management (79)

LEADING EXPERTS TAKE TIN WHISKERS FROM THEORY TO PRACTICE AT IPC CONFERENCE Are we understating the use of tin whisker risk mitigation methodologies?

Industry News | 2012-03-26 15:58:58.0

Tin whisker growth, risk mitigation, detection and failure analysis will be the focus of the IPC Tin Whiskers Conference, April 17–19, 2012, in Ft. Worth, Texas.

Association Connecting Electronics Industries (IPC)

SMTA Capital Announces Speakers for their Vendor Day

Industry News | 2011-07-18 12:24:54.0

The Capital Chapter is pleased to announce the second technical presentation for their Expo and Tech Forum which will be held at the Johns Hopkins University, in Laurel MD on September 13, 2011.

Surface Mount Technology Association (SMTA)

Technical Library: tin whisker risk management (5)

Tin Whisker Risk Management by Conformal Coating

Technical Library | 2015-10-22 17:37:28.0

The objective of this study is to evaluate conformal coatings for mitigation of tin whisker growth. The conformal coatings chosen for the experiment are acrylic, polyurethane and parylene. Also included in this paper are tin whisker inspection results of tin-plated braiding and wire that was exposed to an environment of 50°C with 50% relative humidity for over five years.

Lockheed Martin Corporation

Next Best Thing to a Close Shave: Mitigating the Risks of Tin Whiskers

Technical Library | 2010-09-23 18:22:39.0

If you've been in electronics for any length of time, the phenomenon of tin whiskers is something you've likely heard discussed (maybe in scared whispered tones). Tin whiskers certainly aren't a new problem. In fact, some of the first published reports of the occurrence date back to the 1940’s and 1950's. But, over half a century later, we're still talking about it.

Henkel Electronic Materials

Events Calendar: tin whisker risk management (2)

Tin Whisker - All You Should Know - SMTA Webtorial

Events Calendar | Thu May 17 00:00:00 EDT 2018 - Fri May 18 00:00:00 EDT 2018 | ,

Tin Whisker - All You Should Know - SMTA Webtorial

Surface Mount Technology Association (SMTA)

SMTA China East Conference 2018

Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China

SMTA China East Conference 2018

Surface Mount Technology Association (SMTA)

Express Newsletter: tin whisker risk management (902)

Effects of Tin and Copper Nanotexturization on Tin Whisker Formation

Effects of Tin and Copper Nanotexturization on Tin Whisker Formation SMTnet Express August 17, 2012, Subscribers: 25395, Members: Companies: 8952, Users: 33485 Effects of Tin and Copper Nanotexturization on Tin Whisker Formation First published

An Investigation of Whisker Growth on Tin Coated Wire and Braid

An Investigation of Whisker Growth on Tin Coated Wire and Braid SMTnet Express August 2, 2012, Subscribers: 25335, Members: Companies: 8941, Users: 33403 An Investigation of Whisker Growth on Tin Coated Wire and Braid First published in the 2012

Partner Websites: tin whisker risk management (24)

High Force Pull | Nordson DAGE

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/high-force-pull?con=t&page=10

. Please consult us for further details.  Products Content Your results for: High Force Pull Creep testing of Tin Based Alloys Application Note Nordson DAGE 4600LF Data Sheet Nordson DAGE Dage - Kulicke and Soffa Case Study Nordson DAGE Micro Fracture of Glass Composites

ASYMTEK Products | Nordson Electronics Solutions

IPC Medical Industries Technical Conference: Lead-Free Reliability Readiness - EPTAC - Train. Work S

| https://www.eptac.com/ipc-medical-industries-technical-conference-lead-free-reliability-readiness/

: Reliability Priorities for Lead-Free Dr. Peter van der Heide, Sr. Director of Product Creation Process – Philips Healthcare 9:00 am          Tin Whiskers: Detection, Formation, Mitigation Bob Landman, Technologist


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