Industry Directory | Manufacturer
AIM is a leading global manufacturer of solder assembly materials for the electronics industry.
Industry Directory | Manufacturer
The largest tin/lead secondary smelter in the western hemisphere, with a focus on recycling industrial metal waste streams. Areas of expertise include electronics dross, solder paste, solder wire, solder bar.
New Equipment | Surface Finish
Portable Laser Marking Machine with Laptop LM-106 Product description: Portable Laser Marking Machine with Laptop LM-106 INQUIRY Portable Laser Marking Machine with Laptop LM-106 Product Introduce: 1. Marking / engravi
Portable Laser Marking Machine with Laptop LM-106 Wavelength 1060nm Power 20W Minimum linewidth 0.012mm Range 110mm X 110mm Product description: Portable Laser Marking Machine with Laptop LM-106, Wavelength 1060nm, Power 20W, Minimum linewidth
Electronics Forum | Mon Jun 18 17:41:07 EDT 2001 | genny
Hi, I put this on the technet forum, and I know some of the same people are here, but I thought I might catch others here as well. We have PCB's which are populated at the CM level with no-clean solder paste. However in house we use a solder wire s
Electronics Forum | Thu Oct 21 17:05:11 EDT 2004 | davef
While it's not exactly what you asked, it's similar. Here is a thread from the fine SMTnet Archives from a couple of weeks ago, where we spoke about the topic of mixed lead-free solder with components that have lead-bearing solderability protection:
Industry News | 2016-12-09 23:33:42.0
GPD Global offers advanced dispense pump technologies to upgrade your existing platform and take advantage of existing capital equipment. Retrofit your system with innovative dispensing technology for excellent dispense control and repeatability.
Industry News | 2016-11-21 16:42:03.0
Altus Group is now offering its customers in the UK and Ireland GPD Global's automated dispense systems which in response to customer demand, now have an integrated Pick & Place capability.
Parts & Supplies | Pick and Place/Feeders
937/5000 1. SMT equipment original/imitation accessories sales: Fuji, Juki, Yamaha, Samsung, Panasonic, and other equipment suction nozzle, Feida and accessories, suction Rod, Suction nozzle Rod, sensor, cutter, belt, filter cotton, sensor, light mo
Technical Library | 2009-01-15 00:42:58.0
Tin-silver-copper has received much publicity in recent years as the lead-free solder of choice. SAC305 was endorsed by the IPC Solder Value Product Council in the United States as the preferred option for SMT assembly; most assemblers have transitioned to this alloy for their solder paste requirements. The SAC305 alloy due to its 3.0% content of silver is expensive when compared to traditional 63/37 for this reason many wave assemblers are opting for less costly options such as tin-copper based solders for their wave, selective and dip tinning operations.
Technical Library | 2021-08-25 16:34:37.0
As the traditional eutectic SnPb solder alloy has been outlawed, the electronic industry has almost completely transitioned to the lead-free solder alloys. The conventional SAC305 solder alloy used in lead-free electronic assembly has a high melting and processing temperature with a typical peak reflow temperature of 245ºC which is almost 30ºC higher than traditional eutectic SnPb reflow profile. Some of the drawbacks of this high melting and processing temperatures are yield loss due to component warpage which has an impact on solder joint formation like bridging, open defects, head on pillow.
http://www.gpd-global.com No drip no drool across a wide range of fluid viscosities (low-to-mid and low-to-high). No manual adjustment to compensate for pump variability. Truly Volumetric PCD Pumps for total control of dispensing fluids. Ability to
ALPHA® Preforms with solder paste adds solder volume.
Events Calendar | Thu Jun 14 00:00:00 EDT 2018 - Fri Jun 15 00:00:00 EDT 2018 | ,
SMT Process Fundamentals for Tin-Lead and Lead Free Assembly - SMTA Webtorial
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
SMTnet Express, Septemeber 1, 2016, Subscribers: 26,288, Companies: 14,937, Users: 41,025 Reliability Study of Low Silver Alloy Solder Pastes Jennifer Nguyen, David Geiger and Murad Kurwa; Flex (Flextronics International) Sn3.0Ag0.5Cu (SAC305
SMTnet Express, October 2, 2014, Subscribers: 23352, Members: Companies: 14077, Users: 36923 Assembly Process Feasibility of Low/No Silver Alloy Solder Paste Materials Jennifer Nguyen Ranilo Aranda, David Geiger, and Murad Kurwa; Flextronics
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-selection-guide
(Restriction of Hazardous Substances) directive and sometimes it is a corporate directive. Some applications that fall under the RoHS directive are exempt from being lead-free because the reflow temperature requirements can only be met with high-lead solder alloys which are exempt under RoHS regulation
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
). Figure 2 shows a sample lead-free reflow profile. Figure 2. A sample lead-free reflow profile Since it is a 32 factorial design with three replications, 27 boards were assembled using SnPb paste and 27 boards were assembled using SAC305 paste
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