Industry Directory | Consultant / Service Provider / Manufacturer / Manufacturer's Representative
ChangDa was founded in 2001, it is a comprehensive company that engaged in R&D, production and marketing of thermal insulation and ESD reinforced plastics.
Industry Directory | Manufacturer
professional manufacturer of pcb
Industries : Conveyor Systems & Dry-Cleaning Electronics Military & Defense Railroad Construction Steel Fabricators Materials : 18-8 Stainless Steel 316 Stainless Steel Aluminum Steel Platings : Passiv
New Equipment | Assembly Services
PNC Inc. has been manufacturing hi-reliability printed circuit boards since 1968. All Military Spec PC boards are manufactured in the security of our Nutley NJ, USA facility. PNC is certified by the Department of Defense to Military Performance Speci
Electronics Forum | Mon Jun 27 11:01:58 EDT 2016 | mufflerbearings
From the pic, it looks like you have a bad board; ENIG process issue. It used to be called black pad for SMT but I'm sure it's the same condition for T/H. Any good electronic lab should be able to id the black stuff. I would also send raw boards bac
Electronics Forum | Mon Jul 05 03:44:53 EDT 2004 | johnwnz
Dave, I'm going to disagree with you on the ENIG, it's my 3rd choice only just beating out OSP for that 4th spot. 1. Immersion Silver - cheaper than ENIG, as flat and no issues with Brittle interface (black pad) or Gold Embrittlement) Longer shelf l
Industry News | 2003-06-13 09:56:46.0
Wire and spring specialist William Hughes can now offer three different versions of its PCB test point - small, large and long-legged in quantities suitable for prototype work or volume production.
Industry News | 2018-10-18 09:25:57.0
about wave soldering machine tin pot
Technical Library | 2013-01-17 15:37:21.0
A problem exists with electroless nickel / immersion gold (ENIG) surface finish on some pads, on some boards, that causes the solder joint to separate from the nickel surface, causing an open. The solder has wet and dissolved the gold. A weak tin to nickel intermetallic bond initially occurs, but the intermetallic bond cracks and separates when put under stress. Since the electroless nickel / immersion gold finish performs satisfactory in most applications, there had to be some area within the current chemistry process window that was satisfactory. The problem has been described as a 'BGA Black Pad Problem' or by HP as an 'Interfacial Fracture of BGA Packages…'[1]. A 24 variable experiment using three different chemistries was conducted during the ITRI (Interconnect Technology Research Institute) ENIG Project, Round 1, to investigate what process parameters of the chemical matrix were potentially satisfactory to use and which process parameters of the chemical matrix need to be avoided. The ITRI ENIG Project has completed Round 1 of testing and is now in the process of Round 2 TV (Test Vehicle) build.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Blackfox Training Institute, LLC | https://www.blackfox.com/how-to-remove-oxidation-from-soldering-iron-tips/
. Wait until the tinning product melts around the tip, then clean it with a brass wool or any other tip cleaner Repeat the steps above until the tip is clean
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/draft-ipc7351c_topic2052_post10538.html
. I worked on that committee 3 years ago. Good stuff. Stay connected - follow us! Twitter - LinkedIn tgross Members Profile Send Private Message Find Members Posts Add to Buddy List New User Joined: 10 Mar 2021 Status: Offline Points
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