Industry Directory | Manufacturer
Nihon has been a leader in soldering and brazing since 1966. Nihon manufactures SMT solder joining materials e.g. lead-free solder (SN100C:Sn-Cu-Ni-Ge etc): solder paste, solder spheres, flux cored solder wire, solder bar, etc.
Industry Directory | Manufacturer
Manufacturer of advanced process chemistry for plating, masking and stripping. Custom manufacturing of automated equipment for electrodeposion including; hoist systems, reel-to-reel and continuous vertical processing equipment.
New Equipment | Rework & Repair Equipment
BEST circuit frames come in both dry film and epoxy versions. We can produce circuit frames in 1 and 2 oz copper as well as with shiny tin or nickle gold coating. These circuit frames are microetched on the board side in order to insure better adhesi
New Equipment | Education/Training
The areas in which we are conducting research comprise a comprehensive group of inter-related issues and concerns involving all military, industrial and commercial electronics users facing conversion to lead free solder alloys. REI’s DoD currently
Electronics Forum | Sat Apr 04 19:17:23 EDT 2015 | sync40
Hello to everybody. Does someone have some experience or review in the past with roller tinning machines? I mean low cost machines with two rollers and a molten solder tank. The finished soldermasked PCB pass through the rollers (like a lamination)
Electronics Forum | Fri Jan 27 11:30:47 EST 2006 | solderiron
Kester is offering a tin/copper alloy for lead free. Any comments regarding using just tin/copper as opposed to tin/silver/copper or tin/nickel/copper? the price is low but why wouldn't everyone else offer just this alloy as opposed to the standard S
Used SMT Equipment | SPI / Solder Paste Inspection
Product Details of 3D SPI-6500 Thick Paste Measurement Instrument Product Functions 1, friendly programming interface 2, a variety of measurement methods 3, scan spacing adjustable 4, image 3D simulation function 5, independent 3D dynamic obser
Used SMT Equipment | Hand Assembly
electrical wire 6 8 12 14 16 20 24 44 50 64 pin 2.54 mm pitch idc connectors flat ribbon cable PRODUCT DESCRIPTION ★Rated temperature:80ºC ★Rated voltage:300V ★According to:UL Subject758,UL62,C22.2 ★Solid or stranded,tinned or bare copper
Industry News | 2021-03-25 15:48:41.0
The SMTA Officer team is excited to provide our members with a new webinar by Dr. Nathan Blattau, R&D Fellow at Ansys, Inc., on "Next Generation Lead Free Solders for High Reliability and SMT Yield improvement in Client Computing Systems." The webinar will be on Tuesday, April 6th at 12:00 PM EST and will discuss the evolution of lead free (Pb-free) solder, from tin-silver-copper (SAC) system with silver content of 3.0 and 4.0 to low SAC solders and the emergence of high reliability Pb-free solder. It will cover the reasons and the driving forces of industries implementing this change.
Industry News | 2018-10-18 09:27:40.0
Time Temperature setting wave soldering is the most important in the solder melts
Parts & Supplies | Board Cleaners
engine accessory ai rubber hose silicone rubber hose combusition engines Specifications high quality custom cnc machining aluminum metal part products Item high quality custom cnc machining aluminum metal part products Material Stainless Steel
Parts & Supplies | Soldering - Wave
Overseas Agent and Distributor Wanted ! Features : Spray Fiuxer: 1) Oriental motor drives the flux spraying system. Spraying speed is adjusted according to PCB board width and moving speed to ensure even spraying all time. 2) Durable “Meiji
Technical Library | 2012-10-23 14:25:38.0
Tin-Silver-Copper alloys are the primary choice for lead-free SMT assembly. Although there are other options available such as alloys containing bismuth or indium and other elements, tin-silver-copper solders, also known as SAC alloys are by far the most popular. They are used by approximately 65% of users, as last surveyed by Soldertec in 2003.
Technical Library | 2017-06-13 17:14:59.0
For tin-rich solder alloys, 200 C (392 F) is an extreme temperature. Intermetallic growth in tin-copper systems is known to occur and is believed to bear a direct relationship to failure mechanisms. This study of morphological changes with time at elevated temperatures was made to determine growth rates of tin-copper intermetallics. Preferred growth directions, rates of thickening, and notable changes in morphology were observed.Each of four tin-base alloys was flowed on copper and exposed to temperatures between 100 C and 200 C for time periods of up to 32 days. Metallographic sections were taken and the intermetallics were examined. Intermetallic layer thickening is characterized by several distinct stages. The initial growth of side plates is extremely rapid and exaggerated. This is followed by retrogression (spheroidization) of the elongated peaks and by general thick-
New Upgrade — I.C.T SMT LED Flexible Pick and Place Machine M series In 2022, we have upgraded the equipment of the M series pick and place machine for SMT Production line. I.C.T M series pick and place machine is mainly used for the producti
https://www.ascen.ltd/Products/Solder_paste_printer/513.html full auto PCB screen printer and SMT solder paste printing machine with Image and optical system,It is a very accurate fully automatic SMT stencil printer.automatic PCB screen printer main
Events Calendar | Tue Apr 06 00:00:00 EDT 2021 - Tue Apr 06 00:00:00 EDT 2021 | ,
Capital Chapter Webinar: Next Gen Lead Free Solders for High Reliability & SMT Yield improvement
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | Shen Zhen, China | Management,Sales/Marketing
Working in GLORYPCB for 10 years.knowing electronic supply chain very well. especially for PCB PCBA assembly and other Electronic Manufacturing Service.Glorypcb is a professional electronic manufacturer located in Shenzhen with three facilities.offe
Effects of Tin and Copper Nanotexturization on Tin Whisker Formation SMTnet Express August 17, 2012, Subscribers: 25395, Members: Companies: 8952, Users: 33485 Effects of Tin and Copper Nanotexturization on Tin Whisker Formation First published
An Investigation of Whisker Growth on Tin Coated Wire and Braid SMTnet Express August 2, 2012, Subscribers: 25335, Members: Companies: 8941, Users: 33403 An Investigation of Whisker Growth on Tin Coated Wire and Braid First published in the 2012
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/soldering-processes/selective-soldering-workshops
4.0 Software Infrared Preheating Board Warp Compensation Auto Solder Nozzle Tinning Bullet and Mini-Wave Solder Nozzle Dual Solder Nozzles 75 mm Wave Nozzle Solder Pot Service Cart De-bridging Knife
