Industry Directory | Manufacturer
2Layers - 18Layers ;HASL, OSP, Gold plating, immersion Gold/Silver/Tin, removable mask, gold-finger, carbon ink;Conact Person:Rene E-mail:rene@speedingcircuit.com Website:www.speedingcircuit.com
Industry Directory | Manufacturer
manufactures solder preforms , hermetic covers , heat spreaders and custom welded assembllies
IC'S, Hybrids SMT Silver glass curing BGA reflow Gold/tin reflow Package sealing with N2H2
General specification for Microwave/RF PCB Layer count: 1-6 Board thickness: 0.2-3.2mm Copper thickness: 0.5-4oz Dielectric Constant(DK): 2.2-10.3 Min trace width/spacing: 4/4mil Min drill hole size: 0.2mm Surface treatment: HAL(Lead free), I
Electronics Forum | Fri May 31 08:51:09 EDT 2002 | zanolli
Hello Dave, As related to connector mating interface, fretting corrosion is the oxidation of the contact points, causing high resistance across the interface. Fretting corrosion is caused my micromotions in the interface exposing the metalized conta
Electronics Forum | Mon May 12 23:28:33 EDT 2003 | dehlers
To the best of my knowledge and experience the 2 % Ag component is not for embrittlement but rather to reduce gold scavenging caused by the propensity for tin to react with the gold. I have seen eutectic tin/lead actually disolve gold wire after a f
Industry News | 2003-04-09 08:25:50.0
A new design guide is available from Genalog detailing Samtec's flex circuit capabilities.
Industry News | 2010-11-29 17:46:48.0
With many new legislators coming to Washington, it is a critical time to support ongoing efforts to strengthen the U.S. electronics manufacturing industry. To that end, IPC will hold the IPC Summit on American Competitiveness, February 1–2, 2011, in Washington, D.C.
Technical Library | 1999-05-07 11:28:39.0
There are many things that can go wrong when soldering to gold plate over nickel surfaces. First of all, we know that gold and solder are not good friends, as any time solder comes into contact with gold, something seems to go wrong. Either the solder bonds to the gold and eventually pulls off as the tin and gold cross-migrate, leaving voids; or the solder completely removes the gold and is expected to bond to the metal which was under the gold.
Technical Library | 2013-01-17 15:37:21.0
A problem exists with electroless nickel / immersion gold (ENIG) surface finish on some pads, on some boards, that causes the solder joint to separate from the nickel surface, causing an open. The solder has wet and dissolved the gold. A weak tin to nickel intermetallic bond initially occurs, but the intermetallic bond cracks and separates when put under stress. Since the electroless nickel / immersion gold finish performs satisfactory in most applications, there had to be some area within the current chemistry process window that was satisfactory. The problem has been described as a 'BGA Black Pad Problem' or by HP as an 'Interfacial Fracture of BGA Packages…'[1]. A 24 variable experiment using three different chemistries was conducted during the ITRI (Interconnect Technology Research Institute) ENIG Project, Round 1, to investigate what process parameters of the chemical matrix were potentially satisfactory to use and which process parameters of the chemical matrix need to be avoided. The ITRI ENIG Project has completed Round 1 of testing and is now in the process of Round 2 TV (Test Vehicle) build.
https://www.ascen.ltd/Products/Solder_paste_printer/513.html full auto PCB screen printer and SMT solder paste printing machine with Image and optical system,It is a very accurate fully automatic SMT stencil printer.automatic PCB screen printer main
https://www.ascen.ltd/Products/Solder_paste_printer/513.html full auto PCB screen printer and SMT solder paste printing machine with Image and optical system,It is a very accurate fully automatic SMT stencil printer.automatic PCB screen printer main
Training Courses | | | Cable and Wire Harness Assembly Training Courses
Browse training and certification programs for wire harness cable and connector assembly.
Career Center | Shen Zhen, China | Management,Sales/Marketing
Working in GLORYPCB for 10 years.knowing electronic supply chain very well. especially for PCB PCBA assembly and other Electronic Manufacturing Service.Glorypcb is a professional electronic manufacturer located in Shenzhen with three facilities.offe
Career Center | Houston, Texas USA | Engineering,Management,Quality Control,Technical Support
Seasoned Process & Quality Engineer. Degreed Chemical Engineer. 20+ years in Electronics Semiconductor manufacturing. Proficient in Quality Statistical tools, Design of Experiments, FMEAs, APQP, PPAP, ISO 9000, ISO/TS 16949 etc.
An Investigation of Whisker Growth on Tin Coated Wire and Braid SMTnet Express August 2, 2012, Subscribers: 25335, Members: Companies: 8941, Users: 33403 An Investigation of Whisker Growth on Tin Coated Wire and Braid First published in the 2012
SMT Express, Volume 5, Issue No. 8 - from SMTnet.com Equipment Impacts of Lead Free Wave Soldering The popular tin (Sn) rich lead free solders are causing severe corrosion to many of the materials used in today�s Wave Solder systems
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/1058-lead-delaminations
. Tinning is sometimes done with a noble metal such as gold to improve the adhesion of bond wires. The problem is that some molding compounds do not adhere well to the noble metals
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