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Electronics Forum | Thu Jan 08 13:47:13 EST 2004 | guest
It is my understanding that per IPC specs toe fillets are not required as they do not add any strength to a solder connection. Our thoughts were allways that proper toe fillets are a sign of a good process. What are some of your guidelines and though
Electronics Forum | Wed Apr 11 08:36:23 EDT 2007 | davef
IPC-A-610D refers to 'toe down configuration' several times, beyond the 8.2.5.6 that you question. Although none will add to your understanding of 'toe down'. A lead that is 'toe down' is one where the foot of the lead is not parallel to the pad. T
Industry News | 2012-03-07 19:35:54.0
IPC announces the election of Douglas Pauls, principal materials and process engineer, Rockwell Collins, to chair the IPC Technical Activities Executive Committee (TAEC) for a two-year term. Elected to the position by the chairs and co-chairs of all IPC standards groups, Pauls succeeds Mel Parrish of STI Electronics, Inc. who held the role for IPC’s top standards development oversight committee for the past two years.
Industry News | 2008-10-12 22:46:32.0
BEDFORD, NH � October 2008 � CeTaQ, the leader in quality analysis and optimization of SMT production processes, now offers capability measurement analysis of leaded devices.
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Technical Library | 2018-05-23 12:12:43.0
Driven by miniaturization, cost reduction and tighter requirements for electrical and thermal performance, the use of lead-frame based bottom-termination components (LF-BTC) as small-outline no-leads (SON), quad-flat no leads (QFN) packages etc., is increasing. However, a major distractor for the use of such packages in high-reliability applications has been the lack of a visible solder (toe) fillet on the edge surface of the pins: because the post-package assembly singulation process typically leaves bare copper leadframe at the singulation edge, which is not protected against oxidation and thus does not easily solder-wet, a solder fillet (toe fillet) does not generally develop.
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