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Visit PSI's main Coplanarity Services page for more information. PSI has over 20 years experience restoring gull wing leads on QFP and SOIC packages, as well as myriad surface mount connector styles. The goal of lead restoration is not to mimic "l
Electronics Forum | Thu Feb 17 21:42:12 EST 2000 | Dave F
Hey Bud: Moved from that Bi-crap to something serious, eh? Several things: 1 Get in touch with Doug Romm (drom@msg.ti.com) at Texas Instruments. He talks palladium. 2 Review the archives on Palladium. 3 I think you're running light on temps. Eut
Electronics Forum | Thu Feb 17 21:42:12 EST 2000 | Dave F
Hey Bud: Moved from that Bi-crap to something serious, eh? Several things: 1 Get in touch with Doug Romm (drom@msg.ti.com) at Texas Instruments. He talks palladium. 2 Review the archives on Palladium. 3 I think you're running light on temps. Eut
Technical Library | 2018-05-23 12:12:43.0
Driven by miniaturization, cost reduction and tighter requirements for electrical and thermal performance, the use of lead-frame based bottom-termination components (LF-BTC) as small-outline no-leads (SON), quad-flat no leads (QFN) packages etc., is increasing. However, a major distractor for the use of such packages in high-reliability applications has been the lack of a visible solder (toe) fillet on the edge surface of the pins: because the post-package assembly singulation process typically leaves bare copper leadframe at the singulation edge, which is not protected against oxidation and thus does not easily solder-wet, a solder fillet (toe fillet) does not generally develop.
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AOI - Omron RNS/RNS_ptH, VI3000, Marantz 22X IPC-610D Class 3, Pb/Pb free process, 5S, FMEA, MSA, PPAP, SPC, CPK, 6Sigma, lean manufacturing, Quality management, ISO/TS 16949 ,ISO 9001,ISO 14 001
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AOI - Omron RNS_ptH, RNS-LS, VT-WIN2 VI3000 Marantz 22X IPC 610D certified ISO 9001-2008, etc automotive standards ROHS
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_does-capacitor-height-affect-pad-geometry_topic2366.xml
:12amIf I interpret IPC7351 correctly, then the design approach for chip components is using the actual exposed lead size and adding toe/heel/side fillets to