Industry Directory | Manufacturer
The exclusive supplier of SIPAD Solid Solder Deposit in North America and the only SIPAD Solid Solder Deposit (SSD) coating service bureau in the world.
Industry Directory | Manufacturer
Manufacturer of automated defluxing/cleaning equipment, cleanliness testing equipment, and stencil cleaning equipment.
New Equipment | Solder Paste Stencils
SMT Framed Stencils are laser cut solder paste stencils designed to work on SMT printing machines. These laser cut stencils are permanently glued into a frame. These framed stencils are are designed for highly repeatable continuous operation in volum
New Equipment | Solder Paste Stencils
SMT Foil Stencils are laser cut solder paste stencils designed to work on their own for hand printing or with stencil tensioning systems. These laser cut stencils do not need to be permanently glued in a frame. These so-called frameless stencils are
Electronics Forum | Wed Jul 16 14:21:15 EDT 2014 | toddp2012
Hi all, we have a Speedline Technologies ELEOCTROVERT/Aquastorm 200. In January we stared supplying it with pre-filterd to the DI cabinet next to machine so our large media would last longer. All was fine for about 4 months and then we started gett
Electronics Forum | Sun Nov 26 08:21:41 EST 2006 | callckq
Dear All, Is anyone know why too much solder paste might cause tombstoning defect? Thanks
Industry News | 2012-03-05 14:26:45.0
GPD Global has been awarded a 2012 NPI Award in the category of Dispensing Equipment for its PCD Dispensing on the MAX Series Platform.
Industry News | 2013-10-02 14:39:35.0
Baja Bid announced its latest event which features quality used equipment at discounted prices for the electronics manufacturing industry.
Technical Library | 2022-07-11 09:24:48.0
The change of squeegee pressure has a significant impact on printing. Too small pressure will make the solder paste unable to effectively reach the bottom of the stencil opening and not be well deposited on the pad. Too much pressure will cause tin The paste is printed too thin and can even damage the stencil.
The MPM Momentum II is a proven, highly productive printer platform with a new set of enhanced technologies for further improvement around machine productivity, yield, ease of use, and flexibility.
This is video shows how to print a PCB using a prototype foil only stencil. The SMT prototype stencil (www.soldertools.net) is made from a high nickel content material able to offer repeatable high precision apertures. The steps of alignment, printin
ASCEN Technology | https://www.ascen.ltd/face_mask_production_line/689.html
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| http://etasmt.com/cc?ID=te_news_industry,23962&url=_print
. Is the layout designed for the PIP process? If the PCB hole diameter is too big, it will require too much solder to fill it up. If it is too small, it is very difficult to fill the hole properly with paste during solder paste printing
