Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer / Manufacturer's Representative
DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD is a company which mainly provide used and new SMT parts, provide repair SMT key parts service,new/used SMT machine trading,SMT consumables and Peripherals equipment,Clean room, ESD..
Industry Directory | Manufacturer
Data I/O is the world's leading provider of manual and automated programming solutions for semiconductor (IC) devices. Data I/O's solutions, software and programming engine ensures devices are programmed correctly every time.
We have full range of laser LA SENSOR for JUKI pick & place equipment. New or used available. Pls kindly note highly professional repair service with moderate price from us also. For KE750 P/N:E9630721000 For KE760/740 P/N:E9635725000 For KE2060/2
Repair many kind of Yamaha SMT m/c I/O Board (head or conveyor i/o board) : 1. KGT-M4570-000 2. KV8-M4572-004 3. KM5-M4582-010 4. All models of Yamaha SMT m/c Head/Conveyor I/O boards STOCK : HEAD I/O BOARD ASSY KV8-M4572-004
Electronics Forum | Fri Jun 18 16:16:49 EDT 1999 | Scott Cook
| Ah Yes, 'twas many a year ago, in a land of gambling and fast women. High upon the desert, I received the expert tutelage by the old master so wise and so old. Yup its a small world, Viva Gardnervill. And happy trail's to you, until we meet
Electronics Forum | Fri Jun 18 17:08:28 EDT 1999 | Earl Moon
| | Ah Yes, 'twas many a year ago, in a land of gambling and fast women. High upon the desert, I received the expert tutelage by the old master so wise and so old. Yup its a small world, Viva Gardnervill. And happy trail's to you, until we mee
Used SMT Equipment | Pick and Place/Feeders
Assembleon Topaz XII Pick & Place Model: Topaz II Vintage: 2004 Grid-Lok Max Board Size: 18" x 17.3" 20,000 CPH 0201 Capable 8 Head - Single Beam Complete & Operational Various Feeders Available
Used SMT Equipment | Pick and Place/Feeders
Make: Assembleon Model: M62846 Year: 2008 Type: Placement Machine Details: Assembleon Topaz X-II Placement Machine Low Hours – 15,000 Serial # : FFPR840Y10323290
Industry News | 2003-06-16 09:12:35.0
Boards tout up to 8MGates devices, on-board RAM, banks of I/O, many programmable user interfaces
Industry News | 2003-02-25 09:10:01.0
The CSPEMI400 complements California Micro Devices' broad portfolio of CSP (chip scale package) devices for stand-alone ESD protection and EMI filter arrays with ESD protection, making it the most extensive in the industry.
Parts & Supplies | SMT Equipment
Yamaha Driver board for YAMAHA machin Specs: Driver board for YAMAHA machine All control board for YAMAHA machine provide with repair service. YG200 INTERFACE BORD KGR-M4530-01X YG200 KEYBOARD KGA-M6590-000 YG200 SYSTEM UNIT
Parts & Supplies | Circuit Board Assembly Products
Servo board of YAMAHA machine All control board for YAMAHA machine provide with repair service. YG200 INTERFACE BORD KGR-M4530-01X YG200 KEYBOARD KGA-M6590-000 YG200 SYSTEM UNIT KGK-M4200-101 KGK-M4200-00X YG200 VISION BO
Technical Library | 2021-12-21 23:01:30.0
High density PWB (printed wiring board) with microvia technology is required for implementation of high density and high I/O area array packages (AAP). COTS (commercial off-the-shelf) AAP packaging technologies in high reliability versions with 1.27 mm pitch are now being considered for use in a number of NASA systems including the Space Shuttle and Mars Rovers. NASA functional system designs are requiring ever more denser AAP packages and board features, making board microvia technology very attractive for effectively routing a large number of package inputs/outputs.
Technical Library | 2020-07-08 20:05:59.0
There is a compelling need for functional testing of high-speed input/output signals on circuit boards ranging from 1 gigabit per second (Gbps) to several hundred Gbps. While manufacturing tests such as Automatic Optical Inspection (AOI) and In-Circuit Test (ICT) are useful in identifying catastrophic defects, most high-speed signals require more scrutiny for failure modes that arise due to high-speed conditions, such as jitter. Functional ATE is seldom fast enough to measure high-speed signals and interpret results automatically. Additionally, to measure these adverse effects it is necessary to have the tester connections very close to the unit under test (UUT) as lead wires connecting the instruments can distort the signal. The solution we describe here involves the use of a field programmable gate array (FPGA) to implement the test instrument called a synthetic instrument (SI). SIs can be designed using VHDL or Verilog descriptions and "synthesized" into an FPGA. A variety of general-purpose instruments, such as signal generators, voltmeters, waveform analyzers can thus be synthesized, but the FPGA approach need not be limited to instruments with traditional instrument equivalents. Rather, more complex and peculiar test functions that pertain to high-speed I/O applications, such as bit error rate tests, SerDes tests, even USB 3.0 (running at 5 Gbps) protocol tests can be programmed and synthesized within an FPGA. By using specific-purpose test mechanisms for high-speed I/O the test engineer can reduce test development time. The synthetic instruments as well as the tests themselves can find applications in several UUTs. In some cases, the same test can be reused without any alteration. For example, a USB 3.0 bus is ubiquitous, and a test aimed at fault detection and diagnoses can be used as part of the test of any UUT that uses this bus. Additionally, parts of the test set may be reused for testing another high-speed I/O. It is reasonable to utilize some of the test routines used in a USB 3.0 test, in the development of a USB 3.1 (running at 10 Gbps), even if the latter has substantial differences in protocol. Many of the SI developed for one protocol can be reused as is, while other SIs may need to undergo modifications before reuse. The modifications will likely take less time and effort than starting from scratch. This paper illustrates an example of high-speed I/O testing, generalizes failure modes that are likely to occur in high-speed I/O, and offers a strategy for testing them with SIs within FPGAs. This strategy offers several advantages besides reusability, including tester proximity to the UUT, test modularization, standardization approaching an ATE-agnostic test development process, overcoming physical limitations of general-purpose test instruments, and utilization of specific-purpose test instruments. Additionally, test instrument obsolescence can be overcome by upgrading to ever-faster and larger FPGAs without losing any previously developed design effort. With SIs and tests scalable and upward compatible, the test engineer need not start test development for high-speed I/O from scratch, which will substantially reduce time and effort.
E8631700AA0 DC SERVO DRIVER ASM (Z) E86317150A0 CIRCUIT BOARD ASM. E86317150B0 OPERATION PANEL BOARD B ASM. E86317210A0 MATCHING PWB ASM. E86327150A0 BOARD SENSOR E8633715000 E8633715000 E86377000A0 HEAD RELAY BOARD E8638
https://www.ascen.ltd/Products/Solder_paste_printer/513.html full auto PCB screen printer and SMT solder paste printing machine with Image and optical system,It is a very accurate fully automatic SMT stencil printer.automatic PCB screen printer main
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Career Center | Space Coast, Florida USA | Engineering,Research and Development
Board Level Assembly BGA Expert! We are in need of an Electronic Packaging or Advanced Manufacturing Engineer to work with the Advanced Manufacturing Technology Group of a major Florida based Communications company. Support IR&D and Program activit
Career Center | Melbourne, Florida USA | Engineering
Advanced Manufacturing Technology Position Description Job Description: AMT Engineer � Level 4 Support IR&D and Program activities Division wide working on the development, qualification, and implementation of electronic packaging technologies, wi
Career Center | ORLANDO, Florida USA | Engineering,Maintenance,Production,Technical Support
Manufacturing tech/eng for a contract manufacture for 10+ years. Been working in the SMT industry for a total of 20yrs. Have done everything from operator to process work. Most familiar with Assembleon, MPM, DEK, BTU,Electrovert, SLIM-KIC, SUPER-MOLE
Career Center | kerala, any ware India | Production
i have experience in • Operation of wave soldering and water cleaning machine • Inspection ( Reflow and Post Wave ) • Pre Reflow inspection in SMD • Component forming stuffi
KingFei SMT Tech | https://www.smtspare-parts.com/sale-35281816-9965-000-10930-spline-h2468-fnc-assy-for-assembleon-topazxii-xii.html
9965 000 10928 Spline Shaft, even Heads SF 9965 000 10929 Spline Shaft, Odd Heads SF and FNC 5322 216 04674 I/O Board for Topaz Xii (BD CNV
Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/category/yamaha-1128/page/59?order=name+asc
0.0 CNY LED 2 BOARD ASSY ¥ 0.00 0.0 CNY LED 2 BOARD ASSY ¥ 0.00 0.0 CNY LED Board ¥ 0.00 0.0 CNY LED Driver Board ¥ 0.00 0.0 CNY LED I/O Board ¥ 0.00
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