Industry Directory | Other / Manufacturer
ISO certified global manufacturer and supplier of light-curable adhesives, coatings, oligomers, dispense systems, light-curing equipment, and technical consulting for the industrial, medical, and electronics industries.
Products Description Wave Solder Pallets/ Selective soldering pallets are used to apply electron components to printed circuit boards during PCB assembly. The pallets are made of Noves insulation material. They protect the SMT components in the circ
New Equipment | Wave Soldering
Product Description Noves ESD insulation materials are made by fiberglass & epoxy resin with high-temperature and high-pressure forming, They are a kind of engineering plastic sheet, They are as same as Durostone sheets and Ricocel material. Have be
Industry News | 2020-01-07 11:09:15.0
IPC-8921 establishes classifications and designations for woven and knitted e-textiles integrated with e-fibers, e-yarns and e-wires. It also standardizes key characteristics and durability testing for these materials as well as the industry test methods to be used to test against those characteristics.
Technical Library | 2020-12-16 18:38:49.0
Fabrication of large structures using out-of-autoclave prepreg materials will lead to a great amount of savings in manufacturing costs. In the out-of-autoclave processing method, the presence of voids inside the laminate has been an issue due to the lack of high pressure during manufacturing. This study aims primarily to observe the moisture absorption response of composite samples containing different levels of void. By changing the vacuum level inside the bag during the manufacturing process, three different unidirectional laminates at three levels of void have been manufactured. After immersing the samples in warm water at 60°C for about one year, the moisture absorption level was monitored and then diffusion coefficients were calculated using Fick's law. Results show that the moisture absorption coefficient changes by %8 within the experimental range of void contents. The mechanical behaviour of these laminates has been studied at four different moisture levels by performing dynamic mechanical analysis (DMA) and short beam shear tests. Empirical results indicate that, in general, interlaminar shear strength and glass transition temperature decrease by moisture build-up inside the samples. DiBenedetto equation is proposed to make a correlation between the moisture content and glass transition temperature.
Technical Library | 1999-07-21 08:49:49.0
As the role of direct-chip-attachment increases in the electronics industry, the reliability and performance of COB packaging materials becomes an increasing concern. Although many factors influence component reliability, the biggest determinants of performance are often the glass transition temperature (Tg) and the coefficient of thermal expansion (CTE) of the encapsulant or underfill. This paper discusses exactly what these properties are, how they are measured, and why they are important to device-reliability.
The industrial chain of laser processing has formed a complete ecological chain of laser processing from enterprises producing core lasers upstream to enterprises producing various kinds of laser processing equipment and then to enterprises providing
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/processes/heat-staking-systems?con=t&page=4
Heat Staking Systems | Nordson DIMA DIMA Products Corporate | Global Directory | Languages Division Only All of Nordson Heat Staking Systems Heat Staking process De-forming the plastic is achieved by heating it to a temperature above the glass transition temperature via the use
Imagineering, Inc. | https://www.pcbnet.com/blog/selecting-pcb-materials-for-fabrication/
. In high-heat applications, it is essential that a board continues to work without losing functionality. Glass transition temperature (Tg
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