Industry Directory | Consultant / Service Provider
Design and manufacture of thermal systems for rapid temperature verification and testing, and process cooling. Includes small-footprint thermal chambers and plates, mobile temperature forcing systems, and process chillers.
Industry Directory | Manufacturer
MPIQC is an Electronic Manufacturing Services (EMS) company. Our services are provided at the highest standards to be recognized as a global leader in OEM optimization in IPC Class 2 & Class 3 manufacturing.
New Equipment | Soldering Robots
The product flows from the track into the welding station. After CCD photography, the tin wire drawing mechanism sends the tin wire to the site to be welded, and the laser laser tin completes the welding. Special Features 1 .soldering product w
New Equipment | Soldering Robots
Laser Hot Bar Soldering Machine with CCD Coaxial Positioning Automatic Vision Product Description The product flows from the track into the welding station. After CCD photography, the tin wire drawing mechanism sends the tin wire to the site to b
Industry News | 2020-01-07 11:09:15.0
IPC-8921 establishes classifications and designations for woven and knitted e-textiles integrated with e-fibers, e-yarns and e-wires. It also standardizes key characteristics and durability testing for these materials as well as the industry test methods to be used to test against those characteristics.
Technical Library | 2014-06-26 16:43:12.0
Edgebond adhesives have been widely used by the industry for improving the shock performance of area array packages. Most of the studies focus on the impact of material properties, such as coefficient of thermal expansion (CTE) and glass transition temperature (Tg), on reliability at room temperature. However, the operating temperature of a component on the printed circuit board bonded with edgebond adhesive can be close to or exceed Tg of the adhesive, where the material properties may be very different than at room temperature.
Technical Library | 2021-08-25 16:34:37.0
As the traditional eutectic SnPb solder alloy has been outlawed, the electronic industry has almost completely transitioned to the lead-free solder alloys. The conventional SAC305 solder alloy used in lead-free electronic assembly has a high melting and processing temperature with a typical peak reflow temperature of 245ºC which is almost 30ºC higher than traditional eutectic SnPb reflow profile. Some of the drawbacks of this high melting and processing temperatures are yield loss due to component warpage which has an impact on solder joint formation like bridging, open defects, head on pillow.
This video describes the features of BTU's Pyramax™ convection reflow oven, including the new dual-lane, dual-speed feature which essentially gives one oven the capability of two ovens. Pyramax ovens are known worldwide for superior reliability, unm
With the new EXOS 10/26, Ersa GmbH presents a vacuum reflow soldering system with which the void rate can be reduced by 99%. More about the EXOS 10/26 ? https://www.kurtzersa.com/electronics-production-equipment/soldering-machines/reflow-soldering/pr
Career Center | San Jose, CA, California USA | Engineering,Production,Research and Development
Senior PCB Designer: Want to be part of an exciting pre-IPO enterprise B2B company working on the cutting edge of internet-of-things, artificial intelligence & agents, blockchain, and manufacturing technology? This well-funded venture-backed co
Career Center | , Israel | Engineering,Maintenance,Technical Support
I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr
SMTnet Express, August 26, 2021, Subscribers: 26,759, Companies: 11,431, Users: 26,816 Low Melting Temperature Sn-Bi Solder: Effect of Alloying and Nanoparticle Addition on the Microstructural, Thermal, Interfacial Bonding
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/processes/heat-staking-systems?con=t&page=2
Heat Staking Systems | Nordson DIMA DIMA Products Corporate | Global Directory | Languages Division Only All of Nordson Heat Staking Systems Heat Staking process De-forming the plastic is achieved by heating it to a temperature above the glass transition temperature via the use
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/RSS_determine-hole-size-for-plastic-peg-alignment-pins_topic720.xml
(Glass Transition Temperature)... Author: Tom HSubject: 720Posted: 29 Dec 2012 at 2:51pmThe Tg (Glass Transition Temperature) relates to the PCB expansion in the "Y" axis or board thickness
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