Industry Directory: traversed (2)

KIWI Design

Industry Directory | Distributor / Other

KIWI is the leading provider of top-tier VR accessories.

REDCOM EMS

Industry Directory | Consultant / Service Provider / Manufacturer

Electronics Manufacturing Services; Printed Circuit Board Assembly; Box build including IoT and IIoT Gateways and Hubs. New (2014) assembly line including selective solder. Design support. PCB layout. DfM

New SMT Equipment: traversed (7)

PCBA Board Traverser

PCBA Board Traverser

New Equipment | Board Handling - Conveyors

Apply  The PCB Traverser has horizontal movement and go-through functions, is used for transporting boards from one line into two lines. Features 1. PLC Control system. 2. FUJI button or touch screen control, easily operation. 3. By pass m

HuiKe Tech

PCBA Handling Equipments (Loader / Unloader / Link Conveyor)

PCBA Handling Equipments (Loader / Unloader / Link Conveyor)

New Equipment | Board Handling - Conveyors

1 Bare Board Loader. 2) Magazine Loader & Unloader. 3) Telescopic Conveyor. 4) Link Conveyor (Chain & Belt). 5) Turn Unit. 6) Traverse Unit.

Asia Kinetron Pte Ltd

Electronics Forum: traversed (26)

Fluxer Traverse Speed

Electronics Forum | Fri Sep 25 17:07:57 EDT 2009 | kircchoffs

does anyone knows how to calculate a correct fluxer traverse speed if given a spray width,pcb width & length and wave conveyor speed? thanks

Fluxer Traverse Speed

Electronics Forum | Wed Sep 30 13:13:16 EDT 2009 | mikesewell

I never calculate it when I setup a profile...I have a feel for our fluxer setting and adjust based on belt speed and width. I also have different nozzles and a pressure setting to play with. Inspect the bottom of the board for good coverage. Runn

Used SMT Equipment: traversed (11)

Nutek NTM910TVM Traverser, M-Size, Right to Left

Nutek NTM910TVM Traverser, M-Size, Right to Left

Used SMT Equipment | Conveyors

Nutek Traverser, M-Size (Shuttle conveyor) Type: NTM910TVM Serial Nr.: 2015-0236C01 Year of Manufacture: 2015 Direction: Right to Left Fix Rail: Front PCB size: 70 – 250mm (W)/ 80 – 330mm (L) PCB thickness: 0.60 – 1.60mm Component Height: Top: 30mm m

smtXtra

SMT Wertheim SMT HTT 4.5 K 0.7

Used SMT Equipment | Coating and Encapsulation

I would like to check with you if you may have interest for  SMT HTT 4.5 K 0.7 curing oven. Y/M 2015, but it was never used, brand new condition. It is quattro lane operated machine - edge belt type - 50 mm top & bottom component clearance - Fr

Salescon Ltd.

Industry News: traversed (10)

Industry Reconnects as IPC APEX EXPO 2022 Reconvenes as In-person Event

Industry News | 2022-02-07 17:26:54.0

From revolutionary innovations displayed on the show floor to expert insights conveyed in technical conference sessions, professional development courses and standards development committee meetings, IPC APEX EXPO 2022 provided the education and networking connections that helped 3,647 visitors address today's business challenges and prepare for their factories of future.

Association Connecting Electronics Industries (IPC)

USI Introduces EZ-Flux Automatic Spray Fluxing System

Industry News | 2001-02-12 16:28:41.0

Ultrasonic Systems introduces the EZ-Flux automatic spray fluxing system for economical application of flux to printed circuit boards. EZ-Flux utilizes spray nozzle technology with two-direction spray. An air-actuated traversing mechanism provides precise motion control at a speed of 10-15 inches per second.

Ultrasonic Systems, Inc.

Parts & Supplies: traversed (1)

Technical Library: traversed (2)

Solutions for Selective Soldering of High Thermal Mass and Fine-Pitch Components

Technical Library | 2020-05-07 03:46:27.0

The selective soldering process has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty, however some types of challenging components require additional attention to ensure optimum quality control is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures and/or pallets often places an additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors,can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues due to their beryllium copper termination pins.

SELECT Products | Nordson Electronics Solutions

Techniques for Selective Soldering High Thermal Mass and Fine-Pitch Components

Technical Library | 2022-08-08 15:06:06.0

Selective soldering has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty however some types of challenging components require additional attention to ensure that optimum quality is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures, or solder pallets, often places additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors, can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues because of their beryllium copper base metal pins. Key Terms: Selective soldering, drop-jet fluxing, sustained preheating, flux migration, adjacent clearance, lead-to-hole aspect ratio, lead projection, thermal reliefs, gold embrittlement, solderability testing.

Hentec Industries, Inc. (RPS Automation)

Videos: traversed (12)

PCB shuttle conveyor|PCB-Shuttle-Förderer/ PCB traverser

PCB shuttle conveyor|PCB-Shuttle-Förderer/ PCB traverser

Videos

PCB shuttle conveyor/PCB traverser/shuttle traverser Conveyor/PCB conveyorhttps://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_conveyor/126.html the automatic PCB shuttle conveyor is used to connect dual lane with single lane equipment in the p

ASCEN Technology

PCB traverser

PCB traverser

Videos

PCB shuttle conveyor/PCB traverser/shuttle traverser Conveyor/PCB conveyorhttps://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_conveyor/126.html the automatic PCB shuttle conveyor is used to connect dual lane with single lane equipment in the p

ASCEN Technology

Express Newsletter: traversed (2)


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pressure curing ovens

Training online, at your facility, or at one of our worldwide training centers"
pressure curing ovens

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Have you found a solution to REDUCE DISPENSE REWORK? Your answer is here.
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Software for SMT placement & AOI - Free Download.
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Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.