New Equipment | Solder Materials
Kester Tacky Solder Fluxes (TSFs) are the industrial standard for Flip Chip and BGA Sphere Attach. With viscosities optimized for high speed application and holding of a chip or sphere in place prior to reflow, Kester TSF’s enable wide process window
Electronics Forum | Tue Apr 01 09:03:39 EST 2003 | kmorris
Hi: I'm looking for input from anyone who has experience assembling the MLP package on PCBs. We are experiencing solder opens after assembly, and I'm curious to see how others are processing these critters. The part we are using is a Semtech SH3000
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