Manufacture of Ultrasonic Stencil Cleaning Systems, Cleaning All types of Solder Paste and Adhesives from Stencils and misprinted PCB's, using a single degerent that is enviromentlly safe. Contact us for a free evaluation
Industry Directory | Manufacturer
Shenzhen Huancheng Automation equipment Co.,ltd (referred to as the "HC"), a High-speed developing enterprise specializing in High Precision Automatic Solder Paste Printer research and development.
New Equipment | Test Equipment
Koh Young KY8030-3 3D Inline SPI component Range: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:800kg Product description: Koh Young KY8030-3 3D Inline SPI, component Range: 01005, PCB size:350x330mm, Dimension:1000x1335x1627mm, weight:
New Equipment | Assembly Services
Hanwha HM520 HS SMT Assembly Line Hanwha HM520 HS SMT Assembly Line, Usage: PCB production, Full Automatic Assembly line, Speed: 80000CPH, it's with Automatic PCB Loader, Automatic SMT stencil Printer, Koh Young KY 8080 3D SPI, Automatic Pick and pl
Electronics Forum | Thu Nov 07 10:59:11 EST 2002 | pjc
IPC-7525 "Stencil Design Guidelines" is a good reference document to have. Here are notes from a Tessera, (a major mBGA mfg.), study- "Application Note Solder Stencil Requirement for mBGA" The stencil aperture is to be square, equal in size to the l
Electronics Forum | Thu Nov 07 09:23:05 EST 2002 | russ
What would the considerations be in utilizing a type 4 paste as opposed to type 3? We have an assembly that has a large amount of uBGAs (12 mil diam pad)along with 50 mil pitch BGAs assorted fine pitch etc... We are experiencing difficulty in paste
Used SMT Equipment | SMT Equipment
Product name: σ - F8 high-end module chip mounter Product number: σ - F8 Products in detail σ - F8 features Implement turret head support 1 head pasted on a variety of components. Fully realize fast, general motors, and high availability 4 bea
Used SMT Equipment | Pick and Place/Feeders
Product name: Σ - F8 module chip mounter Product number: Σ - F8 Products in detail Σ - F8 features Implement turret head support 1 head pasted on a variety of components. Fully realize fast, general motors, and high avai
Industry News | 2013-10-09 10:29:04.0
GPD Global will exhibit in Stand 214 in Hall A4 at the Productronica International Trade Fair. On display will be the versatile Max Series platform for dispensing of SMT glue, solder paste, conductive adhesives, underfill, UV, LED and more, configured with the volumetric PCD4H dispense pump and shown for the first time will be the NCM5000 simplified jetting pump.
Industry News | 2018-10-18 08:44:36.0
Lead-free Reflow Profile: Soaking type vs. Slumping type
Parts & Supplies | Pick and Place/Feeders
YAMAHA YV88X nozzle KGA-MT1N1-AOX YAMAHA YV88X SMT nozzle PHILIPS EMRALD ASSY -
Parts & Supplies | Solder Paste Mixers
Solder Paste chambrieren machine,solder Paste softening machine Description: Brand name:solder Paste chambrieren machine Type:4 slot Material:Hot steel spraying Power supply:220V(50Hz) Power:0.4Mpa Original:Shenzhen Weight:20KG Advantage:
Technical Library | 2007-05-31 19:05:55.0
This paper discusses solder paste printing and flux dipping assembly processes for 0.4 and 0.5mm pitch lead-free WLCSPs and the corresponding assembly results and thermal cyclic reliability obtained. Variables evaluated include reflow ambient, paste type, and stencil design. Reliability is also compared to results for the same components assembled under identical conditions using SnPb solder.
Technical Library | 2020-10-27 02:02:17.0
Solder powder size is a popular topic in the electronics industry due to the continuing trend of miniaturization of electronics. The question commonly asked is "when should we switch from Type 3 to a smaller solder powder?" Solder powder size is usually chosen based on the printing requirements for the solder paste. It is common practice to use IPC Type 4 or 5 solder powders for stencil designs that include area ratios below the recommended IPC limit of 0.66. The effects of solder powder size on printability of solder paste have been well documented. The size of the solder powder affects the performance of the solder paste in other ways. Shelf life, stencil life, reflow performance, voiding behavior, and reactivity / stability are all affected by solder powder size. Testing was conducted to measure each of these solder paste performance attributes for IPC Type 3, Type 4, Type 5 and Type 6 SAC305 solder powders in both water soluble and no clean solder pastes. The performance data for each size of solder powder in each solder paste flux was quantified and summarized. Guidance for choosing the optimal size of solder powder is given based on the results of this study.
https://www.ascen.ltd/Products/Solder_paste_printer/513.html full auto PCB screen printer and SMT solder paste printing machine with Image and optical system,It is a very accurate fully automatic SMT stencil printer.automatic PCB screen printer main
https://www.ascen.ltd/Products/Solder_paste_printer/513.html full auto PCB screen printer and SMT solder paste printing machine with Image and optical system,It is a very accurate fully automatic SMT stencil printer.automatic PCB screen printer main
Events Calendar | Wed Apr 18 00:00:00 EDT 2018 - Thu Apr 19 00:00:00 EDT 2018 | ,
Stencil Printing Process and Solder Paste Inspection – An In-Depth Look - SMTA Webtorial
Events Calendar | Mon Feb 11 00:00:00 EST 2019 - Mon Feb 11 00:00:00 EST 2019 | ,
Webinar: Solder Paste Evaluation & Simple Tricks of the Trade
Career Center | Davenport, Iowa USA | Production
SURFACE MOUNT SOLDERER - COOLERS Cobham Mission Systems is seeking a Surface Mount Solderer for our Coolers Department within our Davenport, Iowa facility. This position is open due to an increase in staff. The qualified applicant will perform the
Career Center | San Diego, California USA | Engineering,Management,Production
Customer interaction, inventory and delivery of Stencils. In charge of the Satellite Operation in San Diego, Ca. Report to Headquarters in Lake Forest, Ca. Duties and responsibilities: Take full responsibility for the Satellite Operation facility.
Career Center | , | Engineering,Production,Quality Control
SMT EXPERT WITH DOE ,DFM AND LEAN SKILLS
Career Center | Colton, California USA | Engineering,Maintenance,Production,Quality Control,Research and Development,Technical Support
• Strong experience with the installation, training, and repair on a variety of electro-mechanical, pneumatic, PLC, or computer controlled systems. • Strong Knowledge in SMT equipment, Screen Printer, AOI/SPI, Conformal Coat Systems, Reflow oven, X-R
SMT Express, Volume 4, Issue No. 5 - from SMTnet.com Volume 4, Issue No. 5 Thursday, May 23, 2002 Featured Article Return to Front Page << Back to Page 1 Page 3 >> Knowing the capability coefficients, it is possible to estimate
GPD Global | https://www.gpd-global.com/lead-free-solder-paste-dispensing.php
. PARTICLE TYPE MESH SIZE MICRON SIZE DOT SIZE (MM) 3 -325 +500 45-25 >0.50 4 -400 +635 38-20 >0.40 5 -500 25-15 >0.25 6 -635 15-5 >0.15 Solder Paste Dispensing with Auger Pump Solder Paste Dispensing is best accomplished with an auger pump
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/fluid-types/solder-paste?con=t&page=4
Solder Paste | Nordson ASYMTEK ASYMTEK Products Corporate | Global Directory | Languages Division Only All of Nordson Fluid Dispensing Systems Jets
