New Equipment | Soldering - Other
model: solder paste rewarming machine Origin: Shenzhen, China Color classification: type A: 4 syringe tank + 4 can filling tank
New Equipment | Solder Paste Stencils
Simplify and Speed Up QFN and LGA device rework. StencilMate™ leadless device rework stencils make the process of reworking leadless devices such as QFNs and LGAs simple and fast. These adhesive-backed poyimide stencils are placed on to the bottom o
Electronics Forum | Thu May 11 10:30:55 EDT 2017 | cyber_wolf
Does anyone know of a supplier that offers an "R" type solder paste ? Not "RMA" just "R" Thanks
Electronics Forum | Wed Jan 10 09:30:23 EST 2018 | buckcho
Hello, which type solder paste are you using?
Used SMT Equipment | AOI / Automated Optical Inspection
OMRON AOI VT-RNS2-L Omron AoiVT-RNSⅡ parameters Hardware part LSIZE Image signal input part Camera 3CCD camera Lighting series Ring LED (R.G.B) Image resolution 10, 15, 20um Mechanism part Transmission method Belt transmission method Producti
Used SMT Equipment | Screen Printers
Samsung SP1 Solder Paste Screen Printer For Sales Brand : Samsung Model : SP1 Type : Solder Paste Screen Printer Vintage : 2011 Conditions : Excellent Others : with auto solder feeder Welcome for details Ricky
Industry News | 2012-01-26 22:58:30.0
Seika Machinery will introduce new features for the Seitec Bravo STS-2533 IN H & SJ Soldering System in Booth #2401 at the upcoming IPC APEX Expo.
Industry News | 2018-10-01 20:19:19.0
SHENMAO Technology, Inc. today announced plans to exhibit in Booth A21 at NEPCON Vietnam, scheduled to take place Oct. 11-13, 2018 at the Saigon Exhibition and Convention Center in Ho Chi Minh, Vietnam. SHENMAO will introduce the PF606-P245 solder paste PF606-F13 as well as the PF604-JF3 solder wires.
Technical Library | 2024-02-05 17:51:01.0
Objective: Drying = reducing the humidity in PCB before soldering Preventing delamination caused by thermal stress after moisture absorption Methods: Drying in convection and/ or vacuum oven Parameters subject to material type, soldering surface, layer count, time to soldering, layout (copper-plated areas)
Technical Library | 2018-07-11 22:46:13.0
For a demanding automotive electronics assembly, a highly thermal fatigue resistant solder alloy is required, which makes the lead-free Sn-Ag-Cu type solder alloy unusable. Sn-Ag-Bi-In solder alloy is considered as a high reliability solder alloy due to significant improvement in thermal fatigue resistance as compared to a standard Sn-Ag-Cu alloy. The alloy has not only good thermal fatigue properties but it also has superior ductility and tensile strength by appropriate addition of In; however, initial results indicated a sub-par performance in joint reliability when it is soldered on a printed circuit board (PCB) with Electroless Nickel Immersion Gold (ENIG) surface finish. Numerous experiments were performed to find out appropriate alloying element which would help improve the performance on ENIG PCBs. Sn-Ag-Bi-In solder alloys with and without Cu additions were prepared and then tests were carried out to see the performance in a thermal fatigue test and a drop resistance test.to investigate the impact of Cu addition towards the improvement of joint reliability on ENIG finish PCB. Also, the mechanism of such improvement is documented.
High speed mixer, centrifugal mixer 1200RPM More information, welcome to contact: Web: www.obsmt.com E:sales@obsmt.com T/ Wechat/ Whatsapp: +86 13926596436 Skype: xudan0525
