New Equipment | Cable & Wire Harness Equipment
Overview The PowerStrip 9550 combines the utmost in precision and performance which cover an unbeatable range of application possibilities. Thanks to the modular design, the machine can be adapted to the customer's requirements and processing module
Electronics Forum | Tue Apr 23 15:36:27 EDT 2019 | davef
Josh, are you setting someone up with these questions? Answers to your questions related to the subject line follow: Q1. Does the Epoxy Solder Mask Layer of a PCB protect against moisture absorption? Is this a primary function of the solder mask?
Electronics Forum | Mon Aug 21 19:38:33 EDT 2000 | Dave F
Eric: I�ll pass on the uV and ammonia, also. Thoughts are: 1 You�re correct that the temperature/humidity mix can be a big driver to latex peelable solder mask cure time, but don�t overlook material thickness. Dispensers put material in a very th
Industry News | 2022-04-13 10:22:58.0
MIRTEC will premier its line of 3D AOI and SPI Inspection Systems Hall 4A, Stand 128 at SMTconnect, scheduled to take place May 10-12, 2022 in Nuremberg.
Industry News | 2021-10-11 16:13:11.0
MIRTEC will showcase its cutting-edge INTELLI-PRO AI Based Smart Factory Automation Solution and GENSYS-PIN Automotive Pin Inspection System in booth #461, Hall A2 at the 2021 Productronica exhibition. The world's largest exhibition for the electronic manufacturing industry will take place on Nov. 16-19, 2021, at Messe Munich exhibition hall in Germany.
Parts & Supplies | Assembly Accessories
Detailed Product Description Brand: Samsung Part Name: Power Supply Model: STW400-24 Machine Model: SM482 Condition: Original Used Location: Shenzhen STW400-24 Power Supply For Samsung SM482 Surface Machine Original Used Description: 1, Bra
Parts & Supplies | Assembly Accessories
Detailed Product Description Brand: Panasonic Model: MSMA152A1C Name: AC Servo Motor Input: 200V Current: 9.4A Output: 1.5KW 1500W AC Servo Motor MSMA152A1C For Samsung CP45 Surface Mount Machine Detail Information: 1, Part Name: AC Servo M
Technical Library | 2011-10-20 22:03:30.0
Results of FEM modelling of thermal stress analysis in printed circuit boards are given in the article. It is shown that thermal stress alone is not solely caused by differences in coefficients of thermal expansion of individual layers. The emergence of thermal stress is subject to both the layered structure of the wall and given boundary conditions, as well as the existence of a temperature gradient in the direction normal to the surface of the wall. A practical application focuses on the issue of recycling of PCB with the effort to achieve separation of layers due to thermal stress. Role modelling of thermal stress in this area lies in predicting the possibility of separation, depending on the type of thermal stress and material parameters.
Link: https://www.ascen.ltd/Products/mask_making_machine/ automation medical face mask machine with inner loop welding is automatic from material feeding to mask collection 1.high automation with PLC, photoelectric detection for the raw material feed
Link: https://www.ascen.ltd/Products/mask_making_machine/ automation medical face mask machine with inner loop welding is automatic from material feeding to mask collection 1.high automation with PLC, photoelectric detection for the raw material feed
| https://www.eptac.com/soldertip/soldertip-37-through-hole-soldering-of-thick-pcbs/
. Solder iron temperature, solder iron heat capacity, preheating of the board, are all issues which need to be considered when trying to fill these types of plated through holes
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
desirable but sufficient solder voids greater than the IPC-JSTD-001 specification of 25% were observed to make the investigation valid. Figure 11 (top) illustrates voids of 32% and 29% area on the inner rows of a test component. Additionally, the low voiding
