Industry Directory | Manufacturer
Semiconductor package substrate manufacturer, IC substrate manufacturer
JUKI FTF 16mm Feeder JUKI FTF TYPE 16mm Feeder JUKI SMT machines Juki KE-730,Juki KE-740, Juki KE-750, KE-760, KE-2010,KE-2020,KE-2030,KE-2040,Juki KE-2050,KE-2060,Juki KE-2070,KE-2080,FX-1,FX-2,FX-3.etc. M/P: +86 15323874439 Email: becky@hysmt.cn
JUKI Nozzle for 700&2000 series KD775&780E3401-802-000JUKIKD775 DISP NZ S2D/1S 0.6/0.3P=0.7E3406-802-00JUKI KD775 DISP NZ M1D/2S 0.7/0.4P=1.0E3411-802-000JUKI KD775 DISP NZ L1D/1S 0.9/0.6P=1.5E3416-802-000JUKI KD775 DISP NZ LL 2D/2S 0.9/0.6P=1.5E342
Electronics Forum | Thu Sep 24 07:25:34 EDT 2015 | anilwagh
I have Cyberoptics SPI SE300 Ultra machine purchased from auction. I need service/Electrical/Program manuals.
Electronics Forum | Mon Oct 12 05:54:10 EDT 2015 | anilwagh
I have brought SE300 Ultra spi machine. Is it possible to crate new program on machine? or need offline software.
Used SMT Equipment | AOI / Automated Optical Inspection
Make: Yestech Model: FX-940 Ultra 3D Vintage: 2015 Description: 3D AOI Condition: Complete & Operational Location: USA
Used SMT Equipment | AOI / Automated Optical Inspection
This 2015 Nordson YESTECH FX-940 Ultra 3D AOI is available for immediate purchase. For more information, please contact ashlin@bajabid.com
Industry News | 2020-09-25 03:54:45.0
SMTA is honored to announce Chidinma Imediegwu, a graduate student at the Georgia Institute of Technology, has been selected as the winner of the 2020 Charles Hutchins Educational Grant.
Industry News | 2020-10-10 04:58:25.0
SMTA is pleased to announce, Sabrina M. Rosa-Ortiz, University of South Florida, has been selected as the recipient of the 2020 Joann Stromberg Student Leadership Scholarship.
Parts & Supplies | SMT Equipment
JUKI KE-2020 Q-Motor(E9630729000) Part Number: E9630729000 (20W), Specifications: TS4632N2020E600
Technical Library | 2020-01-15 23:54:34.0
Flexible electronics has significantly advanced over the last few years, as devices and circuits from nanoscale structures to printed thin films have started to appear. Simultaneously, the demand for high-performance electronics has also increased because flexible and compact integrated circuits are needed to obtain fully flexible electronic systems. It is challenging to obtain flexible and compact integrated circuits as the silicon based CMOS electronics, which is currently the industry standard for high-performance, is planar and the brittle nature of silicon makes bendability difficult. For this reason, the ultra-thin chips from silicon is gaining interest. This review provides an in-depth analysis of various approaches for obtaining ultra-thin chips from rigid silicon wafer. The comprehensive study presented here includes analysis of ultra-thin chips properties such as the electrical, thermal, optical and mechanical properties, stress modelling, and packaging techniques. The underpinning advances in areas such as sensing, computing, data storage, and energy have been discussed along with several emerging applications (e.g., wearable systems, m-Health, smart cities and Internet of Things etc.) they will enable. This paper is targeted to the readers working in the field of integrated circuits on thin and bendable silicon; but it can be of broad interest to everyone working in the field of flexible electronics.
Technical Library | 2020-09-08 16:43:32.0
Atomic layer deposition (ALD) is an ultra-thin film deposition technique that has found many applications owing to its distinct abilities. They include uniform deposition of conformal films with controllable thickness, even on complex three-dimensional surfaces, and can improve the efficiency of electronic devices. This technology has attracted significant interest both for fundamental understanding how the new functional materials can be synthesized by ALD and for numerous practical applications, particularly in advanced nanopatterning for microelectronics, energy storage systems, desalinations, catalysis and medical fields. This review introduces the progress made in ALD, both for computational and experimental methodologies, and provides an outlook of this emerging technology in comparison with other film deposition methods. It discusses experimental approaches and factors that affect the deposition and presents simulation methods, such as molecular dynamics and computational fluid dynamics, which help determine and predict effective ways to optimize ALD processes, hence enabling the reduction in cost, energy waste and adverse environmental impacts. Specific examples are chosen to illustrate the progress in ALD processes and applications that showed a considerable impact on other technologies.
The little big one from Ersa in selective soldering - SMARTFLOW 2020: compact without compromises, extremely smart! Winner of the GTI Award 2015. Find our products ? https://www.kurtzersa.com/electronics-production-equipment/soldering-machines/select
The little big one from Ersa in selective soldering - SMARTFLOW 2020: compact without compromises, extremely smart! Winner of the GTI Award 2015. Find our products ? https://www.kurtzersa.com/electronics-production-equipment/soldering-machines/select
Training Courses | | | ESD Control Training Courses
Browse training and certification programs for electrostatic discharge (ESD) control in electronics assembly.
Events Calendar | Thu Mar 18 00:00:00 EDT 2021 - Thu Mar 18 00:00:00 EDT 2021 | ,
India Chapter Webinar: PCBA Process Qualifications
Events Calendar | Tue Mar 30 00:00:00 EDT 2021 - Tue Mar 30 00:00:00 EDT 2021 | ,
Wisconsin Chapter Webinar: PCB Assembly – Labeling and Marking Technology and Materials
Career Center | Bhiwadi, India | Quality Control
TS 16949:2009 certified internal auditor from bsi. Training on ISO QMS 9001:2008. Training on IPC-A-610 standard Training on visual management, Kaizen & 5 S’’ Well versed about 5S, 8D, 7QC tools, 4M, 3R, 4R, kaizen, kanban, poka yoke, PPAP, SPC, ECN,
Career Center | noida, India | Maintenance,Production,Technical Support
Over 16 years of experience in Assembly Line Production, PCB, SMT, Process Improvements, testing & troubleshooting, time and motion study, Value– Engineering as well as Quality in varied industries
HALT Testing of Backward Soldered BGAs on a Military Product Online Version SMTnet Express, December 10, 2015, Subscribers: 23,782, Members: Companies: 14,767, Users: 39,402 Packaging Technology and Design Challenge for Fine Pitch Micro-Bump Cu
Lewis & Clark | https://www.lewis-clark.com/product-tag/mvp-ultra-iii/
MVP Ultra III Archives - Lewis and Clark, Inc. Skip to content My Cart: $ 0.00 0 View Cart Checkout No products in the cart. Subtotal: $ 0.00 View Cart Checkout Lewis and Clark, Inc
Surface Mount Technology Association (SMTA) | https://www.smta.org/panpac/Pan-Pacific-2020-Program.pdf?v=20060405647
Pan Pac 2020 Program TIME LOCATION 12:00PM - 5:30PM Foyer 2:15PM - 2:55PM Lehua/Hau 2:55PM - 3:35PM Lehua/Hau 3:35PM- 3:50PM Courtyard 3:50PM - 4:25PM Lehua/Hau 4:25PM- 5:00PM Lehua/Hau 5:00PM - 6:00PM Breezeway TIME LOCATION Session 1 - Electrochemical Migration
