New Equipment | Solder Materials
High Activity, Completely Odorless, No-clean Solder Paste Exceptional print definition Long stencil life Wide process window Excellent wetting compatibility on most board finishes Low voiding Compatible with enclosed printing
New Equipment | Solder Materials
Introducing LF-4300 (lead-free) and 4300 (tin-lead), two revolutionary synthetic solder pastes that offer such unparalleled versatility and forgiveness, we still don’t believe it. Both the LF-4300 and the 4300 offer true multi-process capabilities,
Electronics Forum | Thu May 13 03:20:36 EDT 2010 | aungthura
it is true.My supplier only sell the sodler paste in Jar,1 jar must have 500g( minimum), although we wanted 250g par jar.
Electronics Forum | Tue May 11 08:21:16 EDT 2010 | nrw
Hello, I am in the process of setting up processes for a low volume SMT line for internal prototype production, where a 500g jar of solder paste would last weeks. Our distributors only seem to want to supply 500g jars (anything else is significantl
Industry News | 2013-01-19 07:46:16.0
Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics
Industry News | 2010-11-02 10:42:48.0
Christopher Associates today announced the US introduction of Koki’s S3X48-M500 and S3X48-M500C Printable No-Clean Lead-Free Solder Pastes. Originally designed and formulated for superior head-in-pillow performance, the pastes also exhibit exceptional wetting and printing.
Parts & Supplies | Pick and Place/Feeders
101004 TRANSISTOR BC108 NPN 101020 POWER SUPPLY – UPRATED CURRENT 101047 SQUEEGEE MATERIAL 9.5 X 9.5 85-90 101081 CONNECTOR CIRCULAR 14WAY 97-3102A 101142 FRONT SQUEEGEE CARRIAGE 101143 OUTER MTG SQUEEGEE BLOCK 101145 COVER (TXT) 101146
Parts & Supplies | Pick and Place/Feeders
101004 TRANSISTOR BC108 NPN 101020 POWER SUPPLY – UPRATED CURRENT 101047 SQUEEGEE MATERIAL 9.5 X 9.5 85-90 101081 CONNECTOR CIRCULAR 14WAY 97-3102A 101142 FRONT SQUEEGEE CARRIAGE 101143 OUTER MTG SQUEEGEE BLOCK 101145 COVER (TXT) 101146
High viscosity impellor-less mixing fast and effective mixing simple bubble dispersion different size machies to suit USB connection to PC (software icluded) no machine clean-up no cross-contamination fast changeover of compound types reusable and di
Career Center | , Texas | Human Resources,Maintenance,Management,Technical Support
Over 17 years in the training and development industry.� I have a track record of successes in designing strategic programs that address organizational skill gaps and business initiatives. Being an expert in Instructional Systems Design (ISD) I have
SMT Express, Issue No. 1 - from SMTnet.com Volume 1, Issue No. 1 Thursday, June 3, 1999 Tricks of the Trade Optimizing Time/Pressure Dispensing ofAdhesives by Chrys Shea Return to Previous Page Over the past
Leaded and Lead-Free Solder Paste Evaluation Screening Procedure Leaded and Lead-Free Solder Paste Evaluation Screening Procedure Numerous studies have shown that greater than 60% of end of line defects in SMT assembly can be traced to solder
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/applications/dispensing-hot-melt-adhesive?con=t&page=7
(SMT Magazine, September 2007) (PDF 8 MB) Advancements in Solder Paste Dispensing Nordson ASYMTEK D. Ashley, S. Adamson (SMT Magazine, July 2008) (PDF 500 KB
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