Electronics Forum | Tue May 30 08:14:34 EDT 2000 | Aerin Bryson
I had a problem accessing my mail for along time, however, that is resolved now. Now I am having trouble sending email - I sent a test message to an internal smtnet recipient and one to an external recipient and both went OK. Other than that I have
Electronics Forum | Tue May 30 09:53:43 EDT 2000 | Neil Peaslee
Right now we are using a custom built web email solution to provide SMTnet web email. Unfortunately the service agreement recently expired and I have to keep a fairly close eye on it to make sure that it is running. Within the next few weeks we will
Industry News | 2003-02-24 09:47:35.0
Mark R. Hollinger, Chairman and CEO, will present at the Raymond James 24th Annual Institutional Investors Conference at 2:40 p.m. ET on Tuesday, March 4th.
Industry News | 2023-10-16 12:50:01.0
MIRTEC announces the release of their All-New ART Hybrid 3D AOI System at Productronica 2023. The World's leading trade fair for the electronics manufacturing industry will take place Nov. 14-17, 2023, at the Trade Fair Center Messe München, Germany. All are welcome to MIRTEC's Booth #461 in Hall A2 for a detailed demonstration of what will undoubtedly be recognized as the World's Most Technologically Advanced 3D AOI System!
Technical Library | 2022-07-11 09:24:48.0
The change of squeegee pressure has a significant impact on printing. Too small pressure will make the solder paste unable to effectively reach the bottom of the stencil opening and not be well deposited on the pad. Too much pressure will cause tin The paste is printed too thin and can even damage the stencil.
Imagineering, Inc. | https://www.pcbnet.com/blog/a-guide-to-pcb-inspection-methods/
. However, as these systems are designed around cameras, they are limited by what they can visually detect. 3D cameras have an advantage in that they can detect height differences, but they are unable to inspect hidden connections that are found in multilayered boards
Blackfox Training Institute, LLC | https://www.blackfox.com/how-to-remove-oxidation-from-soldering-iron-tips/
. Most of which is caused by a heavy buildup of oxidation on the soldering iron tip’s surface. A bad tip is unable to perform an effective heat transfer to the connection point, which then affects the final product in the assembly line
