Industry Directory | Distributor
Formed in 1990, we supply SMT Splicing Tapes & SMT Adhesives. We are the exclusive European & USA distributor for Fuji Chemical Industrial Co Ltd, Japan.
Industry Directory | Manufacturer
Finetech manufactures innovative, high-accuracy equipment for leading-edge bonding, micro assembly and rework challenges.
Retrofit existing system with Innovative Dispensing Technology for Excellent Dispense Control and Repeatability Advanced pump technologies available for retrofitting include: True Volumetric Pump, Precision Auger Pump, Simplified Jetting Pump and Ti
New Equipment | Selective Soldering
Higher Yield - Higher Productivity - Fewer Operators with the Model ZM-R8000B Hot Air BGA Rework Station from Precision PCB Services, Inc. Automatic BGA Rework Station uses machine vision to automatically align component to the circuit board. Nit
Electronics Forum | Thu Sep 22 16:06:07 EDT 2011 | davef
Underfilling BGA is an uncommon practice. We'd start looking to find a consultant recommended by our: * Dispenser company * Underfill supplier
Electronics Forum | Tue Sep 20 08:53:13 EDT 2011 | jocelynlauzon
My company is looking for an IPC expert consultant in BGA underfilling to support an important contract that is being prepared. We are looking for someone with hands-on experience with large (~2"x2", with as much as 1800 pin, 1mm pitch, 0.5mm ball di
Used SMT Equipment | Coating and Encapsulation
Make: PVA Model: Delta 6 Vintage: 2014 Power: 240v, 25A, 60hz PSI: 80-100 3 Axis Fiducial Camera Belt Conveyor PCB Heat JDX + PVA Jet Controls (IO Card) Vacuum Purge Weigh Scale Machine was configured for Underfill, Flip Chip, BGA, Flex a
Industry News | 2011-11-20 13:36:13.0
GPD Global has been awarded two Global Technology Awards in the categories of Adhesives/Coatings/Encapsulants and Dispensing Equipment for its PCD Dispensing on the MAX Series Platform
Industry News | 2012-03-05 14:26:45.0
GPD Global has been awarded a 2012 NPI Award in the category of Dispensing Equipment for its PCD Dispensing on the MAX Series Platform.
Parts & Supplies | Chipshooters / Chip Mounters
SMT Nozzle for QP/QP132/QP242/QP341 FUJI QP242 INDEX SMT NOZZLE Part Number (OEM) Description ABHPN - 8510 ABHPN - 8520 ABHPN - 8530 ABHDN - 8560 ABHDN - 8570 ABHPN - 8590 QP-S-12 -ø 0.7 QP-S-12 NZ. ø 1.0 QP-S-12 NZ. ø 1.3 / 1.0 QP-M-38
Parts & Supplies | Pick and Place/Feeders
Panasonic nozzles available for MSF/MCF/HDP/HD/CM/DT Series MSF Series Nozzles Part Number Description PAMSFSSD Nozzle, SS (Diamond Tip) 1045 9080 04 Nozzle Tip Only, SS (Diamond Tip) PAMSFSD Nozzle, S (Diamond Tip) 1045 9080 14 Nozzle Ti
Technical Library | 2023-08-16 18:42:25.0
In one of our medical applications projects, the customer wanted to dispense a mask to protect gold leads and an underfill on a silicon substrate with a clear test die. The substrates were Dymax X-499-91-C for Masking and Epoxibond-106M-1 for Underfill Dispensing
Technical Library | 2024-08-20 00:40:08.0
In electronics manufacturing, 'Underfill' refers to a material that is applied to fill the gap between a semiconductor device, such as flip-chip assemblies, Ball Grid Arrays (BGA), or Chip Scale Packages (CSP), and the substrate, such as a PCB or flex circuit.
Flux spray coating on a PCB with uniformal thickness down to 5 microns, with clear edge definition and minimal overspray. Can coat large or shoot dots with the same jet.
Dual valves on a single platform. One valve dispenses the dam, a second valve encapsulates the cavity. http://www.nordsonasymtek.com
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Thu Mar 18 00:00:00 EDT 2021 - Thu Mar 18 00:00:00 EDT 2021 | ,
India Chapter Webinar: PCBA Process Qualifications
Events Calendar | Mon Mar 18 00:00:00 EDT 2019 - Mon Mar 18 00:00:00 EDT 2019 | ,
Webinar: Stencil Design for Solder Paste, In Process Inspection & Process Defects
Career Center | , | Engineering
A well respected, cutting edge technology leader in underfill chip scale packaging electronic materials for uses in cell phone, wireless applications and more is in need of a particular combination of experience in process engineering, CSP equipment
Career Center | Irvine, California USA | Sales/Marketing
We are a contract manufacturing company specializing in SMT, Thru-Hole and BGA assembly. Our niche is prototypes and medium volume. Visit our website at www.gmtechnical.com for our capital equipment listing and our capabilities. We are looking fo
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
Career Center | , | Engineering,Technical Support
COMPETENCIES & SKILLS : Proficient in SMT chip Mounters and IC/Flip chip Placers like Assembleon, Panasonic, Yamaha & etc. Experienced in handling Screen Printers like Minami, Dek, Panasonic and semi-automatic Printers. Expert in Camalot
SMTnet Express, April 17, 2014, Subscribers: 22675, Members: Companies: 13858, Users: 36080 A Novel Low Temperature Fast Flow And Fast Cure Reworkable Underfill Dr. Mary Liu and Dr. Wusheng Yin; YINCAE Advanced Materials, LLC. In order to meet
SMTnet Express April 11, 2013, Subscribers: 26336, Members: Companies: 13353, Users: 34557 No-Clean Flux Residue and Underfill Compatibility Effects on Electrical Reliability by: Todd L Kolmodin, VP Quality; Indium Corporation of America No
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/2271-underfill-voids
UNDERFILL VOIDS ACOUSTIC Products Corporate | Global Directory Division Only All of Nordson Home Products/Instruments View All Products LABORATORY ● Gen7 ● D9650 ● D9650Z PRODUCTION ● FastLine P300 ● Facts2 DF2400
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_via-fanout-for-bga_topic1888.xml
PCB Libraries Forum : Via Fanout For BGA PCB Libraries Forum : Via Fanout For BGA This is an XML content feed of; PCB Libraries Forum : Questions & Answers
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