Industry Directory | Manufacturer
Reains Underfilm is a patented Technology which pre-formed thermoplastic, It corner or edge bonds BGA/LGA/CSP packages to the PCB to improve solder joint reliability. It tape & reel packed and fully automatic pick & place on PCB.
Industry Directory | Manufacturer
Alltemated sets the standard for tape and reel packaging, IC programming, lead trim/forming, bake and dry-pack services and carrier tape manufacturing.
Electronics Forum | Tue Jul 30 07:29:06 EDT 2013 | scotceltic
We are currently experiencing thermal shock failure on a BGA package. We are currently looking at improvements to improve the thermal shock properties by using underfilm. I have seen some studies out there that use this process to improve drop test
Electronics Forum | Thu Nov 29 12:42:18 EST 2018 | emeto
Robl, I like this underfilm. Do you think you should place it in the middle of the part? I am curious if they provided some advice to you as how to use it.
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